SNAS850 December   2024 LMX1205

ADVANCE INFORMATION  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Timing Requirements
    7. 5.7 Timing Diagram
    8. 5.8 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
      1. 6.1.1 Range of Dividers and Multiplier
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Power On Reset
      2. 6.3.2 Temperature Sensor
      3. 6.3.3 Clock Input
        1. 6.3.3.1 Clock Input Adjustable Delay
      4. 6.3.4 Clock Outputs
        1. 6.3.4.1 Clock Output Buffers
        2. 6.3.4.2 Clock Output Adjustable Delay
        3. 6.3.4.3 Clock MUX
        4. 6.3.4.4 Clock Divider
        5. 6.3.4.5 Clock Multiplier
          1. 6.3.4.5.1 General Information About the Clock Multiplier
          2. 6.3.4.5.2 State Machine Clock for the Clock Multiplier
            1. 6.3.4.5.2.1 State Machine Clock
          3. 6.3.4.5.3 Calibration for the Clock Multiplier
          4. 6.3.4.5.4 Lock Detect for the Clock Multiplier
      5. 6.3.5 LOGICLK Outputs
        1. 6.3.5.1 LOGICLK Output Format
        2. 6.3.5.2 LOGICLK Dividers
      6. 6.3.6 SYSREF
        1. 6.3.6.1 SYSREF Output Buffers
          1. 6.3.6.1.1 SYSREF Output Buffers for Main Clocks (SYSREFOUT)
          2. 6.3.6.1.2 LOGISYSREF Output Buffer
          3. 6.3.6.1.3 SYSREF Frequency and Delay Generation
          4. 6.3.6.1.4 SYSREFREQ Pins and SYSREFREQ SPI Controlled Fields
            1. 6.3.6.1.4.1 SYSREFREQ Pins Common-Mode Voltage
            2. 6.3.6.1.4.2 SYSREFREQ Windowing Feature
              1. 6.3.6.1.4.2.1 General Procedure Flowchart for SYSREF Windowing Operation
              2. 6.3.6.1.4.2.2 Other Guidance For SYSREF Windowing
              3. 6.3.6.1.4.2.3 For Glitch-Free Output
              4. 6.3.6.1.4.2.4 If Using SYNC Feature
              5. 6.3.6.1.4.2.5 SYNC Feature
      7. 6.3.7 Power-Up Timing
      8. 6.3.8 Treatment of Unused Pins
    4. 6.4 Device Functional Modes Configurations
  8. 7 Register Map
    1. 7.1 Device Registers
  9. 8 Application and Implementation
    1. 8.1 Reference
      1. 8.1.1 Typical Application
        1. 8.1.1.1 Design Requirements
        2. 8.1.1.2 Detailed Design Procedure
        3. 8.1.1.3 Application Plots
    2. 8.2 Power Supply Recommendations
    3. 8.3 Layout
      1. 8.3.1 Layout Guidelines
      2. 8.3.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Device Support
    2. 9.2 Documentation Support
      1. 9.2.1 Related Documentation
    3. 9.3 Receiving Notification of Documentation Updates
    4. 9.4 Support Resources
    5. 9.5 Trademarks
    6. 9.6 Electrostatic Discharge Caution
    7. 9.7 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

5.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1) ±2500 V
Charged device model (CDM), per JEDEC specification JESD22-C101, all pins(2) ±500
(1) JEDEC document JEP155 states that 500V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250V CDM allows safe manufacturing with a standard ESD control process.