(2) The junction-to-ambient thermal resistances are as follows: 157.4°C/W for the TO-92 (LP) package, 51.3°C/W for the TO-252 (NDP) package, 56.3°C/W for the molded PDIP (P), 117.7°C/W for the molded plastic SOIC (D), 171°C/W for the molded plastic VSSOP (DGK). The above thermal resistances for the P, D, and DGK packages apply when the package is soldered directly to the PCB. The value of R
θJA for the WSON (NGT) package is typically 43.3°C/W but is dependent on the PCB trace area, trace material, and the number of layers and thermal vias. For details of thermal resistance and power dissipation for the WSON package, see
AN-1187 Leadless Leadframe Package (LLP).