JAJS600AA march   2000  – july 2023 LP2985-N

PRODUCTION DATA  

  1.   1
  2. 特長
  3. アプリケーション
  4. 概要
  5. Revision History
  6. Pin Configuration and Functions
  7. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  8. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagrams
    3. 7.3 Feature Description
      1. 7.3.1 Output Enable
      2. 7.3.2 Dropout Voltage
      3. 7.3.3 Current Limit
      4. 7.3.4 Undervoltage Lockout (UVLO)
      5. 7.3.5 Output Pulldown
      6. 7.3.6 Thermal Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 Device Functional Mode Comparison
      2. 7.4.2 Normal Operation
      3. 7.4.3 Dropout Operation
      4. 7.4.4 Disabled
  9. Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Recommended Capacitor Types
      2. 8.1.2 Input and Output Capacitor Requirements
      3. 8.1.3 Noise Bypass Capacitor (CBYPASS)
      4. 8.1.4 Reverse Current
      5. 8.1.5 Power Dissipation (PD)
      6. 8.1.6 Estimating Junction Temperature
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Capacitor Characteristics
        2. 8.2.2.2 ON/OFF Input Operation
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Device Nomenclature
    3. 9.3 ドキュメントの更新通知を受け取る方法
    4. 9.4 サポート・リソース
    5. 9.5 Trademarks
    6. 9.6 静電気放電に関する注意事項
    7. 9.7 用語集
  11. 10Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ(パッケージ|ピン)
サーマルパッド・メカニカル・データ
発注情報

Typical Characteristics

at operating temperature TJ = 25°C, VIN = VOUT(NOM) + 1.0 V or 2.5 V (whichever is greater), IOUT = 1 mA, ON/OFF pin tied to VIN, CIN = 1.0 µF, and COUT = 4.7 µF (unless otherwise noted)
GUID-5BEA7955-28CC-4469-9B82-D70429F72C9E-low.png
 
Figure 6-1 VOUT vs Temperature for Legacy Chip
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Figure 6-3 Short-Circuit Current vs Output Voltage for Legacy Chip
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Figure 6-5 Ripple Rejection vs Frequency for Legacy Chip
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Figure 6-7 Ripple Rejection vs Frequency for Legacy Chip
GUID-20221126-SS0I-92WH-TNLQ-ZF7BGM3WDHHH-low.svg
VIN = 5 V, VOUT = 3.3 V, COUT = 10 μF, CBYP = 0 nF
Figure 6-9 Ripple Rejection vs Frequency for New Chip
GUID-950E696A-FE60-4585-906C-039FC4A58A0C-low.png
 
Figure 6-11 Ripple Rejection vs Frequency for Legacy Chip
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Figure 6-13 Ripple Rejection vs Frequency for Legacy Chip
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Figure 6-15 Ripple Rejection vs Frequency for Legacy Chip
GUID-1B9D93CF-F710-4C8A-905E-1B9B728E8546-low.png
 
Figure 6-17 Output Impedance vs Frequency for Legacy Chip
GUID-B6DFB699-723D-4CD1-A452-D9E7707DD1CC-low.png
 
Figure 6-19 Output Noise Density for Legacy Chip
GUID-D3671F1C-F180-4838-A254-27929BC756E7-low.png
 
Figure 6-21 Output Noise Density for Legacy Chip
GUID-4B7B45D6-1FA2-4E3E-8E5F-5A271E018E33-low.png
 
Figure 6-23 Ground Pin vs Load Current for Legacy Chip
GUID-2826FD2B-B1A2-48B0-9C19-C8499A2FB081-low.png
 
Figure 6-25 Dropout Voltage vs Temperature for Legacy Chip
GUID-6B57D9BD-B7F3-4BE1-BED8-67E691D5C464-low.png
 
Figure 6-27 Input Current vs VIN for Legacy Chip
GUID-6EB9D9C1-68CC-468A-B6B6-8B38444BC605-low.png
 
Figure 6-29 GND Pin Current vs Temperature for Legacy Chip
GUID-B1F32AEA-DA8F-4E4A-8799-4BEFECBB3B99-low.png
 
Figure 6-31 Instantaneous Short-Circuit Current for Legacy Chip
GUID-20221125-SS0I-V7CG-3N77-FMKD5N401KFF-low.svg
VIN = 4.3 V, VOUT = 3.3 V
Figure 6-2 VOUT vs Temperature for New Chip
GUID-20221126-SS0I-FLNQ-FPBB-JBNSFTBXGNSS-low.svg
 
Figure 6-4 Short-Circuit Current vs Output Voltage for New Chip
GUID-43D62828-9532-4524-AABF-A5C8FEA69123-low.png
 
Figure 6-6 Ripple Rejection vs Frequency for Legacy Chip
GUID-F5668D55-9911-4F3A-9893-1D191BBCD2E9-low.png
 
Figure 6-8 Ripple Rejection vs Frequency for Legacy Chip
GUID-E7A267C3-64AA-4D4D-AA09-00CF94B37C63-low.png
 
Figure 6-10 Ripple Rejection vs Frequency for Legacy Chip
GUID-178CA270-EB8C-4C51-8DF7-E293245AE8D8-low.png
 
Figure 6-12 Ripple Rejection vs Frequency for Legacy Chip
GUID-20221126-SS0I-41G1-KJ1W-WRGW0WBDW7J8-low.svg
VIN = 3.7 V, VOUT = 3.3 V, COUT = 10 μF, CBYP = 0 nF
Figure 6-14 Ripple Rejection vs Frequency for New Chip
GUID-20221126-SS0I-9NC1-7LJF-CPVZFCHRWNRX-low.svg
 
Figure 6-16 Ripple Rejection vs Frequency for New Chip
GUID-C7003276-71FB-4F20-AB7F-1804DF999915-low.png
 
Figure 6-18 Output Impedance vs Frequency for Legacy Chip
GUID-20221126-SS0I-DHND-VZKK-4DSKNFCL9B69-low.svg
 
Figure 6-20 Output Noise Density vs Frequency for New Chip
GUID-20221126-SS0I-4DF8-RKVQ-TWSFDT7GMRLZ-low.svg
 
Figure 6-22 Output Noise Density vs Frequency for New Chip
GUID-20221126-SS0I-FVHH-QSLZ-6WP6ZDC6RPTB-low.svg
 
Figure 6-24 Ground Pin Current vs Load Current for New Chip
GUID-20221126-SS0I-4BSG-L367-B0D45NSQJ68L-low.svg
 
Figure 6-26 Dropout Voltage vs Temperature for New Chip
GUID-20221126-SS0I-RGCX-LHB6-SLG65B22MSJC-low.svg
 
Figure 6-28 Input Current vs VIN for New Chip
GUID-20221126-SS0I-PDBZ-BRJW-LGFRGKNFVKLB-low.svg
 
Figure 6-30 GND Pin Current vs Temperature for New Chip
GUID-20221126-SS0I-D820-S6Z4-DKKC7HPRN8K4-low.svg
 
Figure 6-32 Short-Circuit Current vs Temperature for New Chip