SNVS539H November   2007  – September 2015 LP38500-ADJ , LP38502-ADJ

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configurations and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagrams
    3. 7.3 Feature Description
      1. 7.3.1 Stability And Phase Margin
      2. 7.3.2 Load Transient Response
      3. 7.3.3 Dropout Voltage
      4. 7.3.4 Reverse Current Path
    4. 7.4 Device Functional Modes
      1. 7.4.1 Short-Circuit Protection
      2. 7.4.2 Enable Operation (LP38502-ADJ Only)
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 External Capacitors
        2. 8.2.2.2 Input Capacitor
        3. 8.2.2.3 Output Capacitor
        4. 8.2.2.4 Setting The Output Voltage
        5. 8.2.2.5 RFI/EMI Susceptibility
        6. 8.2.2.6 Output Noise
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
    1. 9.1 Power Dissipation/Heatsinking
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Printed Circuit Board Layout
    2. 10.2 Layout Examples
      1. 10.2.1 Heatsinking WSON Package
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
      2. 11.1.2 Related Links
    2. 11.2 Community Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ

4 Revision History

Changes from G Revision (June 2015) to H Revision

  • Changed thermal values for KTT (DDPAK/TO-263); add notes 2 and 3 to Thermal Information table Go

Changes from F Revision (April 2013) to G Revision

  • Added Added Device Information and Pin Configuration and Functions sections, ESD Ratings and updated Thermal Information tables, Feature Description, Device Functional Modes, Application and Implementation, Power Supply Recommendations, Layout, Device and Documentation Support , and Mechanical, Packaging, and Orderable Information sections.Go
  • Changed format of EC table Go
  • Deleted obsolete heatsinking information for DDPAK/TO-263 package Go

Changes from E Revision (April 2013) to F Revision

  • Changed layout of National Data Sheet to TI formatGo