SNVS550E September   2009  – January 2017 LP5523

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics
    6. 6.6  Charge Pump Electrical Characteristics
    7. 6.7  LED Driver Electrical Characteristics
    8. 6.8  LED Test Electrical Characteristics
    9. 6.9  Logic Interface Characteristics
    10. 6.10 Recommended External Clock Source Conditions
    11. 6.11 Serial Bus Timing Parameters (SDA, SCL)
    12. 6.12 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Programming
      2. 7.3.2 LED Error Detection
      3. 7.3.3 Energy Efficiency
      4. 7.3.4 Temperature Compensation
      5. 7.3.5 Charge Pump Operational Description
        1. 7.3.5.1 Overview
        2. 7.3.5.2 Output Resistance
        3. 7.3.5.3 Controlling The Charge Pump
        4. 7.3.5.4 LED Forward Voltage Monitoring
        5. 7.3.5.5 Gain Change Hysteresis
      6. 7.3.6 LED Driver Operational Description
        1. 7.3.6.1 Overview
        2. 7.3.6.2 Powering LEDs
        3. 7.3.6.3 Controlling The High-Side LED Drivers
    4. 7.4 Device Functional Modes
      1. 7.4.1 Modes Of Operation
        1. 7.4.1.1 Automatic Power-Save Mode
        2. 7.4.1.2 PWM Power-Save Mode
    5. 7.5 Programming
      1. 7.5.1 I2C-Compatible Control Interface
        1. 7.5.1.1 Data Validity
        2. 7.5.1.2 Start and Stop Conditions
        3. 7.5.1.3 Transferring Data
        4. 7.5.1.4 I2C-Compatible Chip Address
          1. 7.5.1.4.1 Control Register Write Cycle
          2. 7.5.1.4.2 Control Register Read Cycle
          3. 7.5.1.4.3 Auto-Increment Feature
    6. 7.6 Register Maps
      1. 7.6.1 Register Set
      2. 7.6.2 Control Register Details
      3. 7.6.3 Instruction Set
      4. 7.6.4 LED Driver Instructions
        1. 7.6.4.1 Ramp
        2. 7.6.4.2 Ramp Instruction Application Example
        3. 7.6.4.3 Set_PWM
        4. 7.6.4.4 Wait
      5. 7.6.5 LED Mapping Instructions
      6. 7.6.6 Branch Instructions
      7. 7.6.7 Arithmetic Instructions
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Using Two LP5523 Devices in Same Application
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Recommended External Components
        3. 8.2.1.3 Application Curves
      2. 8.2.2 Driving Haptic Feedback with LP5523
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

11 Device and Documentation Support

11.1 Device Support

11.1.1 Third-Party Products Disclaimer

TI'S PUBLICATION OF INFORMATION REGARDING THIRD-PARTY PRODUCTS OR SERVICES DOES NOT CONSTITUTE AN ENDORSEMENT REGARDING THE SUITABILITY OF SUCH PRODUCTS OR SERVICES OR A WARRANTY, REPRESENTATION OR ENDORSEMENT OF SUCH PRODUCTS OR SERVICES, EITHER ALONE OR IN COMBINATION WITH ANY TI PRODUCT OR SERVICE.

11.2 Receiving Notification of Documentation Updates

To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper right corner, click on Alert me to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document.

11.3 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.

11.4 Trademarks

E2E is a trademark of Texas Instruments.

All other trademarks are the property of their respective owners.

11.5 Electrostatic Discharge Caution

esds-image

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

11.6 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.