JAJSD10B March 2017 – July 2018 LP8863-Q1
PRODUCTION DATA.
The LP8863-Q1 has two internal thermal sensors: one for protection purposes (device thermal shutdown) and one for die temperature monitoring. The die temperature monitor block includes a 9-bit ADC to convert the analog thermal-sensor output to a temperature reading available in the register JUNCTION_TEMPERATURE. First temperature result is available 2 ms after the activation of the block and conversion rate is 10 Hz. When the temperature monitor block is disabled register JUNCTION_TEMPERATURE content is –256°C.
The die temperature monitor also includes a thermal window detector. The TEMPERATURE_LIMIT_HIGH and TEMPERATURE_LIMIT_LOW bits set the high and low limits for the thermal window. These thresholds have ±1°C hysteresis: TEMPERATURE _LIMIT_HIGH + 1°C for increasing and TEMPERATURE_LIMIT_HIGH – 1°C for decreasing, for example. If the die temperature increases above the high limit or reduces below the low limit, a fault interrupt is generated. Die temperature monitor (ADC, thermal sensor, and window detector) can be disabled to minimize power dissipation in STANDBY mode. The thermal sensor for TSD is always active.
Figure 23, Figure 24, and Figure 25 show the INT pin and status behaviors of the TSD, temperature high, and temperature low limits.