JAJSQQ8A July 2023 – November 2023 LP8868U-Q1 , LP8868V-Q1 , LP8868W-Q1 , LP8868X-Q1 , LP8868Y-Q1 , LP8868Z-Q1
PRODUCTION DATA
THERMAL METRIC(1) | Device | UNIT | |
---|---|---|---|
SON | |||
14 PINS | |||
RθJA | Junction-to-ambient thermal resistance | 39.1 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 39.5 | °C/W |
RθJB | Junction-to-board thermal resistance | 14.7 | °C/W |
ψJT | Junction-to-top characterization parameter | 0.9 | °C/W |
ψJB | Junction-to-board characterization parameter | 14.7 | °C/W |