Layout is a critical portion of good power supply design. The following guidelines help users design a PCB with the best power conversion performance, thermal performance, and minimized generation of unwanted EMI.
- Close the feedback network, resistor
RFBT and RFBB, to the FB pin. VOUT sense
path away from noisy nodes and preferably through a layer on the other side of a
shielding layer.
- Place the input bypass capacitor CIN
as close as possible to the VIN pin and ground. Grounding for both the input and
output capacitors must consist of localized top side planes that connect to the
GND pin and PAD.
- Place the inductor L close to the SW pin to
reduce magnetic and electrostatic noise.
- Place the output capacitor, COUT close
to the junction of L and the diode D. The L, D, and COUT trace must
be as short as possible to reduce conducted and radiated noise and increase
overall efficiency.
- Make the ground connection for the diode
CIN and COUT as small as possible and tied to the
system ground plane in only one spot (preferably at the COUT ground
point) to minimize conducted noise in the system ground plane.
- For more detail on switching power supply layout considerations see AN-1149 Layout Guidelines for Switching Power Supplies application report