JAJSMD7D October   2005  – July 2024 MAX3221E

PRODUCTION DATA  

  1.   1
  2. 1 特長
  3. 2 アプリケーション
  4. 3 概要
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  ESD Ratings - IEC Specifications
    4. 5.4  Recommended Operating Conditions
    5. 5.5  Thermal Information
    6. 5.6  Electrical Characteristics
    7. 5.7  Electrical Characteristics: Driver
    8. 5.8  Electrical Characteristics: Receiver
    9. 5.9  Electrical Characteristics: Auto-Power Down
    10. 5.10 Switching Characteristics: Driver
    11. 5.11 Switching Characteristics: Receiver
    12. 5.12 Switching Characteristics: Auto-Power Down
    13. 5.13 代表的特性
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Power
      2. 7.3.2 RS-232 Driver
      3. 7.3.3 RS-232 Receiver
      4. 7.3.4 RS-232 Status
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 ドキュメントの更新通知を受け取る方法
    2. 9.2 サポート・リソース
    3. 9.3 Trademarks
    4. 9.4 静電気放電に関する注意事項
    5. 9.5 用語集
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

5.5 Thermal Information

THERMAL METRIC(1) MAX3221E UNIT
DB (SSOP) PW (TSSOP)
16 PINS 16 PINS
RθJA Junction-to-ambient thermal resistance

105.8

 110.9 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 51.9

41.7

 °C/W
RθJB Junction-to-board thermal resistance

57.6

57.2

 °C/W
ψJT Junction-to-top characterization parameter 14.1 4.2 °C/W
ψJB Junction-to-board characterization parameter

56.8

 56.6 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.