JAJSMM6C January   2006  – January 2023 MAX3222E

PRODUCTION DATA  

  1. 1 特長
  2. 2 アプリケーション
  3. 3 概要
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2.     ESD Ratings
    3.     ESD Ratings - IEC Specifications
    4. 6.2 Recommended Operating Conditions
    5. 6.3 Thermal Information
    6. 6.4 Electrical Characteristics
    7. 6.5 Electrical Characteristics: Driver
    8. 6.6 Switching Characteristics: Driver
    9. 6.7 Electrical Characteristics: Receiver
    10. 6.8 Switching Characteristics: Receiver
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Functional Block Diagram
    2. 8.2 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
  10. 10Device and Documentation Support
    1. 10.1 Receiving Notification of Documentation Updates
    2. 10.2 サポート・リソース
    3. 10.3 商標
    4. 10.4 Electrostatic Discharge Caution
    5. 10.5 Glossary
  11. 11Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

6.3 Thermal Information

THERMAL METRIC(1)MAX3222EUNIT
DB (SSOP)DW (SOIC)PW (TSSOP)
20 Pins20 Pins20 Pins
R θJAJunction-to-ambient thermal resistance

91.0

58.094.1°C/W
R θJC(top)Junction-to-case (top) thermal resistance

46.2

30.0

35.2°C/W
R θJBJunction-to-board thermal resistance

46.1

29.6

45.5

°C/W
ψ JTJunction-to-top characterization parameter

12.3

7.7

3.1

°C/W
ψ JBJunction-to-board characterization parameter

45.6

29.3

45.1

°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC package thermal metrics application report.