4 改訂履歴
Changes from C Revision (January 2019) to D Revision
- Added データシートに SOT-23 (8) (DDF) パッケージをGo
Changes from B Revision (April 2018) to C Revision
- Deleted 「製品情報」表から SOT-23 パッケージのプレビュー版表記をGo
- Added 「製品情報」表にSC70パッケージをGo
- Added DCK package information to Device Comparison TableGo
- Deleted DBV package preview notation from Pin Configuration and Functions sectionGo
- Added DCK package drawing and pin functions to Pin Configuration and Functions sectionGo
- Added DBV (SOT-23) and DCK (SC70) thermal informationGo
Changes from A Revision (October 2017) to B Revision
- Added DGK package to Thermal Information table Go
Changes from * Revision (July 2017) to A Revision
- Deleted 「製品情報」表からMCP6291のSC70、SOT-553、SOICパッケージをGo
- Deleted 「製品情報」表からMCP6292のWSONおよびVSSOP (10)パッケージをGo
- Changed 「製品情報」表のMCP6294の14ピンSOICパッケージをプレビューから量産データにGo
- Deleted DCK, DRL, DSG, RTE and 8-pin D packages from Device Comparison table Go
- Deleted DRL (SOT-533) package from MCP6291 pinout image and table in Pin Configuration and Functions section Go
- Deleted MCP6291 DCK (SC70) and D (SOIC) package pinout drawings and pin information from Pin Configuration and Functions sectionGo
- Deleted MCP6292 DSG (WSON) and DGS (VSSOP) package pinout drawings and pin table information in Pin Configuration and Functions section Go
- Deleted package preview note from MCP6294 pinout drawing in Pin Configuration and Functions section Go
- Added MCP6294 Thermal Information table Go