SLAS629B March   2009  – May 2020 MSP430F477 , MSP430F478 , MSP430F479

PRODUCTION DATA.  

  1. 1Device Overview
    1. 1.1 Features
    2. 1.2 Applications
    3. 1.3 Description
    4. 1.4 Functional Block Diagram
  2. 2Revision History
  3. 3Device Comparison
    1. 3.1 Related Products
  4. 4Terminal Configuration and Functions
    1. 4.1 Pin Diagrams
    2. 4.2 Signal Descriptions
      1. Table 4-1 Signal Descriptions
  5. 5Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Supply Current Into AVCC and DVCC Excluding External Current
    5. 5.5  Schmitt-Trigger Inputs – Ports P1 to P6, RST/NMI, JTAG (TCK, TMS, TDI/TCLK,TDO/TDI)
    6. 5.6  Inputs Px.y, TAx
    7. 5.7  Leakage Current – Ports P1 to P6
    8. 5.8  Outputs – Ports P1 to P6
    9. 5.9  Output Frequency
    10. 5.10 Typical Characteristics – Outputs
    11. 5.11 Wake-up Timing From LPM3
    12. 5.12 POR – Brownout Reset (BOR)
    13. 5.13 SVS (Supply Voltage Supervisor and Monitor)
    14. 5.14 DCO
    15. 5.15 Crystal Oscillator, LFXT1, Low-Frequency Mode
    16. 5.16 Crystal Oscillator, LFXT1, High-Frequency Mode
    17. 5.17 Crystal Oscillator, XT2 Oscillator, High-Frequency Mode
    18. 5.18 RAM
    19. 5.19 LCD_A
    20. 5.20 Comparator_A
    21. 5.21 Typical Characteristics – Comparator_A
    22. 5.22 SD16_A, Power Supply and Recommended Operating Conditions
    23. 5.23 SD16_A, Input Range
    24. 5.24 SD16_A, Performance
    25. 5.25 SD16_A, Performance
    26. 5.26 SD16_A, Linearity
    27. 5.27 Typical Characteristics, SD16_A SINAD Performance Over OSR
    28. 5.28 SD16_A, Temperature Sensor and Built-in VCC Sense
    29. 5.29 SD16_A, Built-In Voltage Reference
    30. 5.30 SD16_A, Reference Output Buffer
    31. 5.31 SD16_A, External Reference Input
    32. 5.32 12-Bit DAC, Supply Specifications
    33. 5.33 12-Bit DAC, Linearity Specifications
    34. 5.34 12-Bit DAC, Output Specifications
    35. 5.35 12-Bit DAC, Reference Input Specifications
    36. 5.36 12-Bit DAC, Dynamic Specifications
    37. 5.37 12-Bit DAC, Dynamic Specifications Continued
    38. 5.38 Timer_A
    39. 5.39 Timer_B
    40. 5.40 USCI (UART Mode)
    41. 5.41 USCI (SPI Master Mode)
    42. 5.42 USCI (SPI Slave Mode)
    43. 5.43 USCI (I2C Mode)
    44. 5.44 Flash Memory
    45. 5.45 JTAG Interface
    46. 5.46 JTAG Fuse
  6. 6Detailed Description
    1. 6.1  CPU
    2. 6.2  Instruction Set
    3. 6.3  Operating Modes
    4. 6.4  Interrupt Vector Addresses
    5. 6.5  Special Function Registers (SFRs)
      1. 6.5.1 Interrupt Enable 1 and 2
      2. 6.5.2 Interrupt Flag Register 1 and 2
    6. 6.6  Memory Organization
    7. 6.7  Bootloader (BSL)
    8. 6.8  Flash Memory
    9. 6.9  Peripherals
      1. 6.9.1  Oscillator and System Clock
      2. 6.9.2  Brownout, Supply Voltage Supervisor (SVS)
      3. 6.9.3  Digital I/O
      4. 6.9.4  Watchdog Timer (WDT+)
      5. 6.9.5  Basic Timer1 and Real-Time Clock
      6. 6.9.6  LCD_A Drive With Regulated Charge Pump
      7. 6.9.7  Timer_A3
      8. 6.9.8  Timer_B3
      9. 6.9.9  Universal Serial Communication Interface (USCI)
      10. 6.9.10 Comparator_A
      11. 6.9.11 SD16_A
      12. 6.9.12 DAC12
      13. 6.9.13 Peripheral File Map
    10. 6.10 Input/Output Schematics
      1. 6.10.1  Port P1, P1.0, Input/Output With Schmitt Trigger
      2. 6.10.2  Port P1, P1.1, Input/Output With Schmitt Trigger
      3. 6.10.3  Port P1, P1.2, Input/Output With Schmitt Trigger
      4. 6.10.4  Port P1, P1.3, Input/Output With Schmitt Trigger
      5. 6.10.5  Port P1, P1.4, Input/Output With Schmitt Trigger
      6. 6.10.6  Port P1, P1.5, Input/Output With Schmitt Trigger
      7. 6.10.7  Port P1, P1.6, Input/Output With Schmitt Trigger
      8. 6.10.8  Port P1, P1.7, Input/Output With Schmitt Trigger
      9. 6.10.9  Port P2, P2.0 and P2.1, Input/Output With Schmitt Trigger
      10. 6.10.10 Port P2, P2.2 and P2.3, Input/Output With Schmitt Trigger
      11. 6.10.11 Port P2, P2.4 and P2.5, Input/Output With Schmitt Trigger
      12. 6.10.12 Port P2, P2.6 and P2.7, Input/Output With Schmitt Trigger
      13. 6.10.13 Port P3, P3.0 and P3.3, Input/Output With Schmitt Trigger
      14. 6.10.14 Port P3, P3.1 and P3.2, Input/Output With Schmitt Trigger
      15. 6.10.15 Port P3, P3.4 to P3.7, Input/Output With Schmitt Trigger
      16. 6.10.16 Port P4, P4.0 to P4.7, Input/Output With Schmitt Trigger
      17. 6.10.17 Port P5, P5.0 and P5.1, Input/Output With Schmitt Trigger
      18. 6.10.18 Port P5, P5.2 to P5.7, Input/Output With Schmitt Trigger
      19. 6.10.19 Port P6, P6.0 and P6.3, Input/Output With Schmitt Trigger
      20. 6.10.20 Port P6, P6.1 and P6.4, Input/Output With Schmitt Trigger
      21. 6.10.21 Port P6, P6.2, P6.5, and P6.6, Input/Output With Schmitt Trigger
      22. 6.10.22 Port P6, P6.7, Input/Output With Schmitt Trigger
      23. 6.10.23 Segment Pin Schematic: Sx, Dedicated Segment Pins
      24. 6.10.24 Segment Pin Schematic: COM0, Dedicated COM0 Pin
      25. 6.10.25 JTAG Pins TMS, TCK, TDI/TCLK, TDO/TDI, Input/Output With Schmitt Trigger or Output
      26. 6.10.26 JTAG Fuse Check Mode
  7. 7Device and Documentation Support
    1. 7.1 Device Support
      1. 7.1.1 Getting Started and Next Steps
      2. 7.1.2 Development Tools Support
        1. 7.1.2.1 Recommended Hardware Options
          1. 7.1.2.1.1 Target Socket Boards
          2. 7.1.2.1.2 Experimenter Boards
          3. 7.1.2.1.3 Debugging and Programming Tools
          4. 7.1.2.1.4 Production Programmers
        2. 7.1.2.2 Recommended Software Options
          1. 7.1.2.2.1 Integrated Development Environments
          2. 7.1.2.2.2 MSP430Ware
          3. 7.1.2.2.3 Command-Line Programmer
      3. 7.1.3 Device Nomenclature
    2. 7.2 Documentation Support
    3. 7.3 Related Links
    4. 7.4 Support Resources
    5. 7.5 Trademarks
    6. 7.6 Electrostatic Discharge Caution
    7. 7.7 Export Control Notice
    8. 7.8 Glossary
  8. 8Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

5.36 12-Bit DAC, Dynamic Specifications

Vref = VCC, DAC12IR = 1, over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 5-24 and Figure 5-25)
PARAMETER TEST CONDITIONS VCC MIN TYP MAX UNIT
tON DAC12 on time DAC12_xDAT = 800h,
ErrorV(O) < ±0.5 LSB(1)
(see Figure 5-24)		 DAC12AMPx = 0 → {2, 3, 4} 2.2 V, 3 V 60 120 µs
DAC12AMPx = 0 → {5, 6} 15 30
DAC12AMPx = 0 → 7 6 12
tS(FS) Settling time, full scale DAC12_xDAT =
80h→F7Fh→80h		 DAC12AMPx = 2 2.2 V, 3 V 100 200 µs
DAC12AMPx = 3, 5 40 80
DAC12AMPx = 4, 6, 7 15 30
tS(C–C) Settling time, code to code DAC12_xDAT =
3F8h→408h→3F8h
BF8h→C08h→BF8h		 DAC12AMPx = 2 2.2 V, 3 V 5 µs
DAC12AMPx = 3, 5 2
DAC12AMPx = 4, 6, 7 1
SR Slew rate DAC12_xDAT =
80h→F7Fh→80h(2) 		DAC12AMPx = 2 2.2 V, 3 V 0.05 0.12 V/µs
DAC12AMPx = 3,5 0.35 0.7
DAC12AMPx = 4, 6, 7 1.5 2.7
Glitch energy, full-scale DAC12_xDAT =
80h→F7Fh→80h		 DAC12AMPx = 2 2.2 V, 3 V 600 nV-s
DAC12AMPx = 3,5 150
DAC12AMPx = 4, 6, 7 30
(1) RLoad and CLoad connected to AVSS (not AVCC/2) in Figure 5-24.
(2) Slew rate applies to output voltage steps ≥200 mV.
MSP430F479 MSP430F478 MSP430F477 slas508_settling_glitch_testing.gifFigure 5-24 Settling Time and Glitch Energy Testing
MSP430F479 MSP430F478 MSP430F477 slas508_slew_rate_test.gifFigure 5-25 Slew Rate Testing