JAJSG87B September 2013 – September 2018 MSP430F5232 , MSP430F5234 , MSP430F5237 , MSP430F5239 , MSP430F5242 , MSP430F5244 , MSP430F5247 , MSP430F5249
PRODUCTION DATA.
Figure 4-1 shows the pinout for the MSP430F5249 and MSP430F5247 devices in the 64-pin RGC package.
NOTE:
TI recommends connecting the exposed thermal pad to VSS.Figure 4-2 shows the pinout for the MSP430F5244 and MSP430F5242 devices in the 48-pin RGZ package.
NOTE:
TI recommends connecting the exposed thermal pad to VSS.Figure 4-3 shows the pinout for the MSP430F5239 and MSP430F5237 devices in the 64-pin RGC package.
NOTE:
TI recommends connecting the exposed thermal pad to VSS.Figure 4-4 shows the pinout for the MSP430F5234 and MSP430F5232 devices in the 48-pin RGZ package.
NOTE:
TI recommends connecting the exposed thermal pad to VSS.Figure 4-5 shows the pinout for the MSP430F5249, MSP430F5247, MSP430F5239, and MSP430F5237 devices in the 80-pin ZQE package.