JAJSG88D May   2013  – October 2020 MSP430F5252 , MSP430F5253 , MSP430F5254 , MSP430F5255 , MSP430F5256 , MSP430F5257 , MSP430F5258 , MSP430F5259

PRODUCTION DATA  

  1. 1 特長
  2. 2 アプリケーション
  3. 3 概要
  4. 4 Functional Block Diagram
  5. 5 Revision History
  6. 6 Device Comparison
    1. 6.1 Related Products
  7. 7 Terminal Configuration and Functions
    1. 7.1 Pin Diagrams
    2. 7.2 Signal Descriptions
  8. 8 Specifications
    1. 8.1  Absolute Maximum Ratings
    2. 8.2  ESD Ratings
    3. 8.3  Recommended Operating Conditions
    4. 8.4  Active Mode Supply Current Into VCC Excluding External Current
    5. 8.5  Low-Power Mode Supply Currents (Into VCC) Excluding External Current
    6. 8.6  Thermal Resistance Characteristics
    7. 8.7  Schmitt-Trigger Inputs – General-Purpose I/O DVCC Domain (P5.0 to P5.5, P6.0 to P6.7, PJ.0 to PJ.3, RSTDVCC)
    8. 8.8  Schmitt-Trigger Inputs – General-Purpose I/O DVIO Domain (P1.0 to P1.7, P2.0 to P2.7, P3.0 to P3.4, P4.0 to P4.7, P7.0 to P7.5, RST/NMI, BSLEN)
    9. 8.9  Inputs – Interrupts DVCC Domain Port P6 (P6.0 to P6.7)
    10. 8.10 Inputs – Interrupts DVIO Domain Ports P1 and P2 (P1.0 to P1.7, P2.0 to P2.7)
    11. 8.11 Leakage Current – General-Purpose I/O DVCC Domain (P5.0 to P5.5, P6.0 to P6.7, PJ.0 to PJ.3)
    12. 8.12 Leakage Current – General-Purpose I/O DVIO Domain (P1.0 to P1.7, P2.0 to P2.7, P3.0 to P3.4, P4.0 to P4.7, P7.0 to P7.5)
    13. 8.13 Outputs – General-Purpose I/O DVCC Domain (Full Drive Strength) (P5.0 to P5.5, P6.0 to P6.7, PJ.0 to PJ.3)
    14. 8.14 Outputs – General-Purpose I/O DVCC Domain (Reduced Drive Strength) (P5.0 to P5.5, P6.0 to P6.7, PJ.0 to PJ.3)
    15. 8.15 Outputs – General-Purpose I/O DVIO Domain (Full Drive Strength) (P1.0 to P1.7, P2.0 to P2.7, P3.0 to P3.4, P4.0 to P4.7, P7.0 to P7.5)
    16. 8.16 Outputs – General-Purpose I/O DVIO Domain (Reduced Drive Strength) (P1.0 to P1.7, P2.0 to P2.7, P3.0 to P3.4, P4.0 to P4.7, P7.0 to P7.5)
    17. 8.17 Output Frequency – General-Purpose I/O DVCC Domain (P5.0 to P5.5, P6.0 to P6.7, PJ.0 to PJ.3)
    18. 8.18 Output Frequency – General-Purpose I/O DVIO Domain (P1.0 to P1.7, P2.0 to P2.7, P3.0 to P3.4, P4.0 to P4.7, P7.0 to P7.5)
    19. 8.19 Typical Characteristics – Outputs, Reduced Drive Strength (PxDS.y = 0)
    20. 8.20 Typical Characteristics – Outputs, Full Drive Strength (PxDS.y = 1)
    21. 8.21 Crystal Oscillator, XT1, Low-Frequency Mode
    22. 8.22 Crystal Oscillator, XT2
    23. 8.23 Internal Very-Low-Power Low-Frequency Oscillator (VLO)
    24. 8.24 Internal Reference, Low-Frequency Oscillator (REFO)
    25. 8.25 DCO Frequency
    26. 8.26 PMM, Brownout Reset (BOR)
    27. 8.27 PMM, Core Voltage
    28. 8.28 PMM, SVS High Side
    29. 8.29 PMM, SVM High Side
    30. 8.30 PMM, SVS Low Side
    31. 8.31 PMM, SVM Low Side
    32. 8.32 Wake-up Times From Low-Power Modes and Reset
    33. 8.33 Timer_A
    34. 8.34 Timer_B
    35. 8.35 USCI (UART Mode) Clock Frequency
    36. 8.36 USCI (UART Mode)
    37. 8.37 USCI (SPI Master Mode) Clock Frequency
    38. 8.38 USCI (SPI Master Mode)
    39. 8.39 USCI (SPI Slave Mode)
    40. 8.40 USCI (I2C Mode)
    41. 8.41 10-Bit ADC, Power Supply and Input Range Conditions
    42. 8.42 10-Bit ADC, Timing Parameters
    43. 8.43 10-Bit ADC, Linearity Parameters
    44. 8.44 REF, External Reference
    45. 8.45 REF, Built-In Reference
    46. 8.46 Comparator_B
    47. 8.47 Flash Memory
    48. 8.48 JTAG and Spy-Bi-Wire Interface
    49. 8.49 DVIO BSL Entry
  9. 9 Detailed Description
    1. 9.1  CPU
    2. 9.2  Operating Modes
    3. 9.3  Interrupt Vector Addresses
    4. 9.4  Memory Organization
    5. 9.5  Bootloader (BSL)
      1. 9.5.1 Bootloader – I2C
      2. 9.5.2 Bootloader – UART
    6. 9.6  JTAG Operation
      1. 9.6.1 JTAG Standard Interface
      2. 9.6.2 Spy-Bi-Wire Interface
    7. 9.7  Flash Memory
    8. 9.8  RAM
    9. 9.9  Peripherals
      1. 9.9.1  Digital I/O
      2. 9.9.2  Port Mapping Controller
      3. 9.9.3  Oscillator and System Clock
      4. 9.9.4  Power-Management Module (PMM)
      5. 9.9.5  Hardware Multiplier
      6. 9.9.6  Real-Time Clock (RTC_A)
      7. 9.9.7  Watchdog Timer (WDT_A)
      8. 9.9.8  System Module (SYS)
      9. 9.9.9  DMA Controller
      10. 9.9.10 Universal Serial Communication Interface (USCI)
      11. 9.9.11 TA0
      12. 9.9.12 TA1
      13. 9.9.13 TA2
      14. 9.9.14 TB0
      15. 9.9.15 Comparator_B
      16. 9.9.16 ADC10_A
      17. 9.9.17 CRC16
      18. 9.9.18 Reference (REF) Module Voltage Reference
      19. 9.9.19 Embedded Emulation Module (EEM) (S Version)
      20. 9.9.20 Peripheral File Map
    10. 9.10 Input/Output Diagrams
      1. 9.10.1  Port P1 (P1.0 to P1.7) Input/Output With Schmitt Trigger
      2. 9.10.2  Port P2 (P2.0 to P2.7) Input/Output With Schmitt Trigger
      3. 9.10.3  Port P3 (P3.0 to P3.4) Input/Output With Schmitt Trigger
      4. 9.10.4  Port P4 (P4.0 to P4.7) Input/Output With Schmitt Trigger
      5. 9.10.5  Port P5 (P5.0 and P5.1) Input/Output With Schmitt Trigger
      6. 9.10.6  Port P5 (P5.2 and P5.3) Input/Output With Schmitt Trigger
      7. 9.10.7  Port P5 (P5.4 and P5.5) Input/Output With Schmitt Trigger
      8. 9.10.8  Port P6 (P6.0 to P6.7) Input/Output With Schmitt Trigger
      9. 9.10.9  Port P7 (P7.0 to P7.5) Input/Output With Schmitt Trigger
      10. 9.10.10 Port J (PJ.0) JTAG Pin TDO, Input/Output With Schmitt Trigger or Output
      11. 9.10.11 Port J (PJ.1 to PJ.3) JTAG Pins TMS, TCK, TDI/TCLK, Input/Output With Schmitt Trigger or Output
    11. 9.11 Device Descriptors
  10. 10Device and Documentation Support
    1. 10.1  Getting Started and Next Steps
    2. 10.2  Device Nomenclature
    3. 10.3  Tools and Software
    4. 10.4  Documentation Support
    5. 10.5  Related Links
    6. 10.6  サポート・リソース
    7. 10.7  Trademarks
    8. 10.8  静電気放電に関する注意事項
    9. 10.9  Export Control Notice
    10. 10.10 用語集
  11. 11Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

8.6 Thermal Resistance Characteristics

THERMAL METRIC(1)(2)VALUEUNIT
RθJAJunction-to-ambient thermal resistance, still airVQFN 64 (RGC)29.3°C/W
BGA 80 (ZQE)52.0
RθJC(TOP)Junction-to-case (top) thermal resistanceVQFN 64 (RGC)14.2°C/W
BGA 80 (ZQE)23.9
RθJC(BOTTOM)Junction-to-case (bottom) thermal resistanceVQFN 64 (RGC)1.1°C/W
BGA 80 (ZQE)N/A(3)
RθJBJunction-to-board thermal resistanceVQFN 64 (RGC)8.2°C/W
BGA 80 (ZQE)29.3
ΨJTJunction-to-package-top thermal characterization parameterVQFN 64 (RGC)0.2°C/W
BGA 80 (ZQE)0.5
ΨJBJunction-to-board thermal characterization parameterVQFN 64 (RGC)8.1°C/W
BGA 80 (ZQE)29.3
(1) For more information about traditional and new thermal metrics, see Semiconductor and IC Package Thermal Metrics.
(2) These values are based on a JEDEC-defined 2S2P system (with the exception of the Theta JC [RθJC] value, which is based on a JEDEC-defined 1S0P system) and will change based on environment as well as application. For more information, see these EIA/JEDEC standards:
  • JESD51-2, Integrated Circuits Thermal Test Method Environmental Conditions - Natural Convection (Still Air)
  • JESD51-3, Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages
  • JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages
  • JESD51-9, Test Boards for Area Array Surface Mount Package Thermal Measurements
(3) N/A = not applicable