JAJSG69H January 2010 – May 2021 MSP430F5418A , MSP430F5419A , MSP430F5435A , MSP430F5436A , MSP430F5437A , MSP430F5438A
PRODUCTION DATA
THERMAL METRIC | VALUE | UNIT | |||
---|---|---|---|---|---|
RθJA | Junction-to-ambient thermal resistance, still air | Low-K board (JESD51-3) | LQFP (PZ) | 50.1 | °C/W |
LQFP (PN) | 57.9 | ||||
BGA (ZQW) | 60 | ||||
High-K board (JESD51-7) | LQFP (PZ) | 40.8 | |||
LQFP (PN) | 37.9 | ||||
BGA (ZQW) | 42 | ||||
See (1) and (2) | nFBGA (ZCA) | 36.2 | |||
RθJC | Junction-to-case thermal resistance (1)(2) | LQFP (PZ) | 8.9 | °C/W | |
LQFP (PN) | 10.3 | ||||
BGA (ZQW) | 8 | ||||
RθJCtop | Junction-to-case (top) thermal resistance (1)(2) | nFBGA (ZCA) | 13.5 | °C/W | |
RθJB | Junction-to-board thermal resistance (1)(2) | 14.5 | °C/W | ||
ψJT | Junction-to-top characterization parameter (1)(2) | 0.3 | °C/W | ||
ψJB | Junction-to-board characterization parameter(1)(2) | 14.3 | °C/W |