JAJSG52N March 2009 – September 2018 MSP430F5513 , MSP430F5514 , MSP430F5515 , MSP430F5517 , MSP430F5519 , MSP430F5521 , MSP430F5522 , MSP430F5524 , MSP430F5525 , MSP430F5526 , MSP430F5527 , MSP430F5528 , MSP430F5529
PRODUCTION DATA.
Figure 4-1 shows the pinout for the MSP430F5529, MSP430F5527, MSP430F5525, and MSP430F5521 devices in the 80-pin PN package.
Figure 4-2 shows the pinout for the MSP430F5528, MSP430F5526, MSP430F5524, and MSP430F5522 devices in the 64-pin RGC package.
NOTE:
TI recommends connecting the exposed thermal pad to VSS.Figure 4-3 shows the pinout for the MSP430F5519, MSP430F5517, and MSP430F5515 devices in the 80-pin PN package.
Figure 4-4 shows the pinout for the MSP430F5514 and MSP430F5513 devices in the 64-pin RGC package.
NOTE:
TI recommends connecting the exposed thermal pad to VSS.Figure 4-5 shows the pinout for the MSP430F5528, MSP430F5526, MSP430F5524, MSP430F5522, MSP430F5514, and MSP430F5513 devices in the 80-pin ZQE package.
Figure 4-6 shows the pinout for the MSP430F5528, MSP430F5526, and MSP430F5524 devices in the 64-pin YFF package. For package dimensions, see the Mechanical Data in Section 8.