2 改訂履歴
Changes from November 3, 2015 to September 20, 2018
- 「製品情報」の表でDSBGAパッケージの本体サイズの記載内容を変更Go
- Added Section 3.1, Related ProductsGo
- Removed D and E dimension lines from the YFF pinout (for package dimensions, see the Mechanical Data in Section 8)Go
- Added typical conditions statements at the beginning of Section 5, SpecificationsGo
- Changed the MIN value of the V(DVCC_BOR_hys) parameter from 60 mV to 50 mV in Section 5.20, PMM, Brownout Reset (BOR)Go
- Updated notes (1) and (2) and added note (3) in Section 5.26, Wake-up Times From Low-Power Modes and ResetGo
- Removed ADC12DIV from the formula for the TYP value in the second row of the tCONVERT parameter in Section 5.36, 12-Bit ADC, Timing Parameters, because ADC12CLK is after divisionGo
- Added second row for tEN_CMP with Test Conditions of "CBPWRMD = 10" and MAX value of 100 µs in Section 5.42, Comparator_BGo
- Renamed FCTL4.MGR0 and MGR1 bits in the fMCLK,MGR parameter in Section 5.48, Flash Memory, to be consistent with header filesGo
- Throughout document, changed all instances of "bootstrap loader" to "bootloader"Go
- Added YFF pin numbers to Table 6-11, TA0 Signal ConnectionsGo
- Added YFF pin numbers to Table 6-12, TA1 Signal ConnectionsGo
- Added YFF pin numbers to Table 6-13, TA2 Signal ConnectionsGo
- 従来の「開発ツールのサポート」セクションをSection 7.3「ツールとソフトウェア」に置き換えGo
- Section 7.4「ドキュメントのサポート」のフォーマットを変更し、内容を追加Go