JAJSG13G October 2012 – August 2018 MSP430FR5947 , MSP430FR59471 , MSP430FR5948 , MSP430FR5949 , MSP430FR5957 , MSP430FR5958 , MSP430FR5959 , MSP430FR5967 , MSP430FR5968 , MSP430FR5969 , MSP430FR59691
PRODUCTION DATA.
Figure 4-1 shows the 48-pin RGZ package for the MSP430FR596x and MSP430FR596x1 MCUs.
NOTE:
TI recommends connecting the QFN package pad to VSS.NOTE:
On devices with UART BSL: P2.0: BSLTX; P2.1: BSLRXNOTE:
On devices with I2C BSL: P1.6: BSLSDA; P1.7: BSLSCLFigure 4-2 shows the 40-pin RHA package for the MSP430FR594x and MSP430FR594x1 MCUs (LFXT only).
NOTE:
TI recommends connecting the QFN package pad to VSS.NOTE:
On devices with UART BSL: P2.0: BSLTX; P2.1: BSLRXNOTE:
On devices with I2C BSL: P1.6: BSLSDA; P1.7: BSLSCLFigure 4-3 shows the 38-pin DA package for the MSP430FR594x MCUs (LFXT only).
NOTE:
On devices with UART BSL: P2.0: BSLTX; P2.1: BSLRXFigure 4-4 shows the 40-pin RHA package for the MSP430FR595x MCUs (HFXT only).
NOTE:
TI recommends connecting the QFN package pad to VSS.NOTE:
On devices with UART BSL: P2.0: BSLTX; P2.1: BSLRXFigure 4-5 shows the 38-pin DA package for the MSP430FR595x MCUs (HFXT only).
NOTE:
On devices with UART BSL: P2.0: BSLTX; P2.1: BSLRX