JAJSG26C March   2016  – August 2018 MSP430FR5962 , MSP430FR5964 , MSP430FR5992 , MSP430FR5994 , MSP430FR59941

PRODUCTION DATA.  

  1. 1デバイスの概要
    1. 1.1 特長
    2. 1.2 アプリケーション
    3. 1.3 概要
    4. 1.4 機能ブロック図
  2. 2改訂履歴
  3. 3Device Comparison
    1. 3.1 Related Products
  4. 4Terminal Configuration and Functions
    1. 4.1 Pin Diagrams
    2. 4.2 Pin Attributes
    3. 4.3 Signal Descriptions
      1. Table 4-2 Signal Descriptions
    4. 4.4 Pin Multiplexing
    5. 4.5 Buffer Types
    6. 4.6 Connection of Unused Pins
  5. 5Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Active Mode Supply Current Into VCC Excluding External Current
    5. 5.5  Typical Characteristics, Active Mode Supply Currents
    6. 5.6  Low-Power Mode (LPM0, LPM1) Supply Currents Into VCC Excluding External Current
    7. 5.7  Low-Power Mode (LPM2, LPM3, LPM4) Supply Currents (Into VCC) Excluding External Current
    8. 5.8  Low-Power Mode (LPMx.5) Supply Currents (Into VCC) Excluding External Current
    9. 5.9  Typical Characteristics, Low-Power Mode Supply Currents
    10. 5.10 Typical Characteristics, Current Consumption per Module
    11. 5.11 Thermal Packaging Characteristics
    12. 5.12 Timing and Switching Characteristics
      1. 5.12.1  Power Supply Sequencing
        1. Table 5-1 Brownout and Device Reset Power Ramp Requirements
        2. Table 5-2 SVS
      2. 5.12.2  Reset Timing
        1. Table 5-3 Reset Input
      3. 5.12.3  Clock Specifications
        1. Table 5-4 Low-Frequency Crystal Oscillator, LFXT
        2. Table 5-5 High-Frequency Crystal Oscillator, HFXT
        3. Table 5-6 DCO
        4. Table 5-7 Internal Very-Low-Power Low-Frequency Oscillator (VLO)
        5. Table 5-8 Module Oscillator (MODOSC)
      4. 5.12.4  Wake-up Characteristics
        1. Table 5-9  Wake-up Times From Low-Power Modes and Reset
        2. 5.12.4.1   Typical Characteristics, Average LPM Currents vs Wake-up Frequency
        3. Table 5-10 Typical Wake-up Charge
      5. 5.12.5  Digital I/Os
        1. Table 5-11 Digital Inputs
        2. Table 5-12 Digital Outputs
        3. 5.12.5.1   Typical Characteristics, Digital Outputs at 3.0 V and 2.2 V
        4. Table 5-13 Pin-Oscillator Frequency, Ports Px
        5. 5.12.5.2   Typical Characteristics, Pin-Oscillator Frequency
      6. 5.12.6  LEA (Low-Energy Accelerator) (MSP430FR599x Only)
        1. Table 5-14 Low Energy Accelerator Performance
      7. 5.12.7  Timer_A and Timer_B
        1. Table 5-15 Timer_A
        2. Table 5-16 Timer_B
      8. 5.12.8  eUSCI
        1. Table 5-17 eUSCI (UART Mode) Clock Frequency
        2. Table 5-18 eUSCI (UART Mode)
        3. Table 5-19 eUSCI (SPI Master Mode) Clock Frequency
        4. Table 5-20 eUSCI (SPI Master Mode)
        5. Table 5-21 eUSCI (SPI Slave Mode)
        6. Table 5-22 eUSCI (I2C Mode)
      9. 5.12.9  ADC12_B
        1. Table 5-23 12-Bit ADC, Power Supply and Input Range Conditions
        2. Table 5-24 12-Bit ADC, Timing Parameters
        3. Table 5-25 12-Bit ADC, Linearity Parameters
        4. Table 5-26 12-Bit ADC, Dynamic Performance With External Reference
        5. Table 5-27 12-Bit ADC, Dynamic Performance With Internal Reference
        6. Table 5-28 12-Bit ADC, Temperature Sensor and Built-In V1/2
        7. Table 5-29 12-Bit ADC, External Reference
      10. 5.12.10 Reference
        1. Table 5-30 REF, Built-In Reference
      11. 5.12.11 Comparator
        1. Table 5-31 Comparator_E
      12. 5.12.12 FRAM
        1. Table 5-32 FRAM
      13. 5.12.13 Emulation and Debug
        1. Table 5-33 JTAG and Spy-Bi-Wire Interface
  6. 6Detailed Description
    1. 6.1  Overview
    2. 6.2  CPU
    3. 6.3  Low-Energy Accelerator (LEA) for Signal Processing (MSP430FR599x Only)
    4. 6.4  Operating Modes
      1. 6.4.1 Peripherals in Low-Power Modes
      2. 6.4.2 Idle Currents of Peripherals in LPM3 and LPM4
    5. 6.5  Interrupt Vector Table and Signatures
    6. 6.6  Bootloader (BSL)
    7. 6.7  JTAG Operation
      1. 6.7.1 JTAG Standard Interface
      2. 6.7.2 Spy-Bi-Wire Interface
    8. 6.8  FRAM Controller A (FRCTL_A)
    9. 6.9  RAM
    10. 6.10 Tiny RAM
    11. 6.11 Memory Protection Unit (MPU) Including IP Encapsulation
    12. 6.12 Peripherals
      1. 6.12.1  Digital I/O
      2. 6.12.2  Oscillator and Clock System (CS)
      3. 6.12.3  Power-Management Module (PMM)
      4. 6.12.4  Hardware Multiplier (MPY)
      5. 6.12.5  Real-Time Clock (RTC_C)
      6. 6.12.6  Watchdog Timer (WDT_A)
      7. 6.12.7  System Module (SYS)
      8. 6.12.8  DMA Controller
      9. 6.12.9  Enhanced Universal Serial Communication Interface (eUSCI)
      10. 6.12.10 TA0, TA1, and TA4
      11. 6.12.11 TA2 and TA3
      12. 6.12.12 TB0
      13. 6.12.13 ADC12_B
      14. 6.12.14 Comparator_E
      15. 6.12.15 CRC16
      16. 6.12.16 CRC32
      17. 6.12.17 AES256 Accelerator
      18. 6.12.18 True Random Seed
      19. 6.12.19 Shared Reference (REF)
      20. 6.12.20 Embedded Emulation
        1. 6.12.20.1 Embedded Emulation Module (EEM) (S Version)
        2. 6.12.20.2 EnergyTrace++ Technology
    13. 6.13 Input/Output Diagrams
      1. 6.13.1  Capacitive Touch Functionality on Ports P1 to P8, and PJ
      2. 6.13.2  Port P1 (P1.0 to P1.2) Input/Output With Schmitt Trigger
      3. 6.13.3  Port P1 (P1.3 to P1.5) Input/Output With Schmitt Trigger
      4. 6.13.4  Port P1 (P1.6 and P1.7) Input/Output With Schmitt Trigger
      5. 6.13.5  Port P2 (P2.0 to P2.2) Input/Output With Schmitt Trigger
      6. 6.13.6  Port P2 (P2.3 and P2.4) Input/Output With Schmitt Trigger
      7. 6.13.7  Port P2 (P2.5 and P2.6) Input/Output With Schmitt Trigger
      8. 6.13.8  Port P2 (P2.7) Input/Output With Schmitt Trigger
      9. 6.13.9  Port P3 (P3.0 to P3.3) Input/Output With Schmitt Trigger
      10. 6.13.10 Port P3 (P3.4 to P3.7) Input/Output With Schmitt Trigger
      11. 6.13.11 Port P4 (P4.0 to P4.3) Input/Output With Schmitt Trigger
      12. 6.13.12 Port P4 (P4.4 to P4.7) Input/Output With Schmitt Trigger
      13. 6.13.13 Port P5 (P5.0 to P5.7) Input/Output With Schmitt Trigger
      14. 6.13.14 Port P6 (P6.0 to P6.7) Input/Output With Schmitt Trigger
      15. 6.13.15 Port P7 (P7.0 to P7.3) Input/Output With Schmitt Trigger
      16. 6.13.16 Port P7 (P7.4 to P7.7) Input/Output With Schmitt Trigger
      17. 6.13.17 Port P8 (P8.0 to P8.3) Input/Output With Schmitt Trigger
      18. 6.13.18 Port PJ (PJ.4 and PJ.5) Input/Output With Schmitt Trigger
      19. 6.13.19 Port PJ (PJ.6 and PJ.7) Input/Output With Schmitt Trigger
      20. 6.13.20 Port PJ (PJ.0 to PJ.3) JTAG Pins TDO, TMS, TCK, TDI/TCLK, Input/Output With Schmitt Trigger
    14. 6.14 Device Descriptors (TLV)
    15. 6.15 Memory Map
      1. 6.15.1 Peripheral File Map
    16. 6.16 Identification
      1. 6.16.1 Revision Identification
      2. 6.16.2 Device Identification
      3. 6.16.3 JTAG Identification
  7. 7Applications, Implementation, and Layout
    1. 7.1 Device Connection and Layout Fundamentals
      1. 7.1.1 Power Supply Decoupling and Bulk Capacitors
      2. 7.1.2 External Oscillator
      3. 7.1.3 JTAG
      4. 7.1.4 Reset
      5. 7.1.5 Unused Pins
      6. 7.1.6 General Layout Recommendations
      7. 7.1.7 Do's and Don'ts
    2. 7.2 Peripheral- and Interface-Specific Design Information
      1. 7.2.1 ADC12_B Peripheral
        1. 7.2.1.1 Partial Schematic
        2. 7.2.1.2 Design Requirements
        3. 7.2.1.3 Detailed Design Procedure
        4. 7.2.1.4 Layout Guidelines
  8. 8デバイスおよびドキュメントのサポート
    1. 8.1  使い始めと次の手順
    2. 8.2  デバイスの項目表記
    3. 8.3  ツールとソフトウェア
    4. 8.4  ドキュメントのサポート
    5. 8.5  関連リンク
    6. 8.6  Community Resources
    7. 8.7  商標
    8. 8.8  静電気放電に関する注意事項
    9. 8.9  Export Control Notice
    10. 8.10 Glossary
  9. 9メカニカル、パッケージ、および注文情報

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

Table 5-5 High-Frequency Crystal Oscillator, HFXT(5)

over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER TEST CONDITIONS VCC MIN TYP MAX UNIT
IDVCC.HFXT HFXT oscillator crystal current HF mode at typical ESR fOSC = 4 MHz,
HFXTBYPASS = 0, HFXTDRIVE = 0,
HFFREQ = 1(8), TA = 25°C,
CL,eff = 18 pF, typical ESR, Cshunt 		3.0 V 75 μA
fOSC = 8 MHz,
HFXTBYPASS = 0, HFXTDRIVE = 1,
HFFREQ = 1, TA = 25°C,
CL,eff = 18 pF, typical ESR, Cshunt 		120
fOSC = 16 MHz,
HFXTBYPASS = 0, HFXTDRIVE = 2,
HFFREQ = 2, TA = 25°C
CL,eff = 18 pF, typical ESR, Cshunt 		190
fOSC = 24 MHz
HFXTBYPASS = 0, HFXTDRIVE = 3,
HFFREQ = 3, TA = 25°C
CL,eff = 18 pF, typical ESR, Cshunt 		250
fHFXT HFXT oscillator crystal frequency, crystal mode HFXTBYPASS = 0, HFFREQ = 1 (8)(7) 4 8 MHz
HFXTBYPASS = 0, HFFREQ = 2 (7) 8.01 16
HFXTBYPASS = 0, HFFREQ = 3 (7) 16.01 24
DCHFXT HFXT oscillator duty cycle. Measured at SMCLK,
fHFXT = 16 MHz		 40% 50% 60%
fHFXT,SW HFXT oscillator logic-level square-wave input frequency, bypass mode HFXTBYPASS = 1, HFFREQ = 0(6)(7) 0.9 4 MHz
HFXTBYPASS = 1, HFFREQ = 1(6)(7) 4.01 8
HFXTBYPASS = 1, HFFREQ = 2(6)(7) 8.01 16
HFXTBYPASS = 1, HFFREQ = 3(6)(7) 16.01 24
DCHFXT, SW HFXT oscillator logic-level square-wave input duty cycle HFXTBYPASS = 1 40% 60%
OAHFXT Oscillation allowance for HFXT crystals(9) HFXTBYPASS = 0, HFXTDRIVE = 0,
HFFREQ = 1(8),
fHFXT,HF = 4 MHz, CL,eff = 16 pF		 450 Ω
HFXTBYPASS = 0, HFXTDRIVE = 1,
HFFREQ = 1
fHFXT,HF = 8 MHz, CL,eff = 16 pF		 320
HFXTBYPASS = 0, HFXTDRIVE = 2,
HFFREQ = 2
fHFXT,HF = 16 MHz, CL,eff = 16 pF		 200
HFXTBYPASS = 0, HFXTDRIVE = 3,
HFFREQ = 3
fHFXT,HF = 24 MHz, CL,eff = 16 pF		 200
tSTART,HFXT Startup time(10) fOSC = 4 MHz,
HFXTBYPASS = 0, HFXTDRIVE = 0,
HFFREQ = 1, TA = 25°C, CL,eff = 16 pF		 3.0 V 1.6 ms
fOSC = 24 MHz,
HFXTBYPASS = 0, HFXTDRIVE = 3,
HFFREQ = 3, TA = 25°C, CL,eff = 16 pF		 0.6
CHFXIN Integrated load capacitance at HFXIN terminaI(1)(2) 2 pF
CHFXOUT Integrated load capacitance at HFXOUT terminaI(1)(2) 2 pF
fFault,HFXT Oscillator fault frequency(4)(3) 0 800 kHz
(1) This represents all the parasitic capacitance present at the HFXIN and HFXOUT terminals, respectively, including parasitic bond and package capacitance. The effective load capacitance, CL,eff can be computed as CIN × COUT / (CIN + COUT), where CIN and COUT is the total capacitance at the HFXIN and HFXOUT terminals, respectively.
(2) Requires external capacitors at both terminals to meet the effective load capacitance specified by crystal manufacturers. Recommended effective load capacitance values supported are 14 pF, 16 pF, and 18 pF. Maximum shunt capacitance of 7 pF. The PCB adds additional capacitance, so it must also be considered in the overall capacitance. Verify that the recommended effective load capacitance of the selected crystal is met.
(3) Measured with logic-level input frequency but also applies to operation with crystals.
(4) Frequencies above the MAX specification do not set the fault flag. Frequencies between the MIN and MAX might set the flag. A static condition or stuck at fault condition will set the flag.
(5) To improve EMI on the HFXT oscillator the following guidelines should be observed.
  • Keep the traces between the device and the crystal as short as possible.
  • Design a good ground plane around the oscillator pins.
  • Prevent crosstalk from other clock or data lines into oscillator pins HFXIN and HFXOUT.
  • Avoid running PCB traces underneath or adjacent to the HFXIN and HFXOUT pins.
  • Use assembly materials and processes that avoid any parasitic load on the oscillator HFXIN and HFXOUT pins.
  • If conformal coating is used, ensure that it does not induce capacitive or resistive leakage between the oscillator pins.
(6) When HFXTBYPASS is set, HFXT circuits are automatically powered down. Input signal is a digital square wave with parametrics defined in the Schmitt-trigger Inputs section of this datasheet. Duty cycle requirements are defined by DCHFXT, SW.
(7) Maximum frequency of operation of the entire device cannot be exceeded.
(8) HFFREQ = {0} is not supported for HFXT crystal mode of operation.
(9) Oscillation allowance is based on a safety factor of 5 for recommended crystals.
(10) Includes startup counter of 1024 clock cycles.

The DCO (see Table 5-6) is an internal digitally controlled oscillator (DCO) with selectable frequencies.