JAJSGU5B January 2019 – December 2021 MSP430FR5041 , MSP430FR5043 , MSP430FR50431 , MSP430FR6041 , MSP430FR6043 , MSP430FR60431
PRODUCTION DATA
THERMAL METRIC(1) | PACKAGE | VALUE(2) | UNIT | |
---|---|---|---|---|
RθJA | Junction-to-ambient thermal resistance, still air | QFP-80 (PN) | 53.3 | °C/W |
RθJC(TOP) | Junction-to-case (top) thermal resistance | 15.2 | °C/W | |
RθJB | Junction-to-board thermal resistance | 28.4 | °C/W | |
ΨJB | Junction-to-board thermal characterization parameter | 28.0 | °C/W | |
ΨJT | Junction-to-top thermal characterization parameter | 0.7 | °C/W | |
RθJC(BOTTOM) | Junction-to-case (bottom) thermal resistance | N/A(3) | °C/W | |
RθJA | Junction-to-ambient thermal resistance, still air | QFP-64 (PM) | 56.6 | °C/W |
RθJC(TOP) | Junction-to-case (top) thermal resistance | 16.4 | °C/W | |
RθJB | Junction-to-board thermal resistance | 27.8 | °C/W | |
ΨJB | Junction-to-board thermal characterization parameter | 27.5 | °C/W | |
ΨJT | Junction-to-top thermal characterization parameter | 0.8 | °C/W | |
RθJC(BOTTOM) | Junction-to-case (bottom) thermal resistance | N/A | °C/W | |
RθJA | Junction-to-ambient thermal resistance, still air | RGC-64 | 24.7 | °C/W |
RθJC(TOP) | Junction-to-case (top) thermal resistance | 12.3 | °C/W | |
RθJB | Junction-to-board thermal resistance | 8.8 | °C/W | |
ΨJB | Junction-to-board thermal characterization parameter | 8.7 | °C/W | |
ΨJT | Junction-to-top thermal characterization parameter | 0.1 | °C/W | |
RθJC(BOTTOM) | Junction-to-case (bottom) thermal resistance | N/A | °C/W |