JAJSDV8E August   2011  – January 2017 OMAP-L132

PRODUCTION DATA.  

  1. 1デバイスの概要
    1. 1.1 特長
    2. 1.2 アプリケーション
    3. 1.3 概要
    4. 1.4 機能ブロック図
  2. 2Revision History
  3. 3Device Comparison
    1. 3.1 Device Characteristics
    2. 3.2 Device Compatibility
    3. 3.3 ARM Subsystem
      1. 3.3.1 ARM926EJ-S RISC CPU
      2. 3.3.2 CP15
      3. 3.3.3 MMU
      4. 3.3.4 Caches and Write Buffer
      5. 3.3.5 Advanced High-Performance Bus (AHB)
      6. 3.3.6 Embedded Trace Macrocell (ETM) and Embedded Trace Buffer (ETB)
      7. 3.3.7 ARM Memory Mapping
    4. 3.4 DSP Subsystem
      1. 3.4.1 C674x DSP CPU Description
      2. 3.4.2 DSP Memory Mapping
        1. 3.4.2.1 ARM Internal Memories
        2. 3.4.2.2 External Memories
        3. 3.4.2.3 DSP Internal Memories
        4. 3.4.2.4 C674x CPU
    5. 3.5 Memory Map Summary
      1. Table 3-4 OMAP-L132 Top Level Memory Map
    6. 3.6 Pin Assignments
      1. 3.6.1 Pin Map (Bottom View)
    7. 3.7 Pin Multiplexing Control
    8. 3.8 Terminal Functions
      1. 3.8.1  Device Reset, NMI and JTAG
      2. 3.8.2  High-Frequency Oscillator and PLL
      3. 3.8.3  Real-Time Clock and 32-kHz Oscillator
      4. 3.8.4  DEEPSLEEP Power Control
      5. 3.8.5  External Memory Interface A (EMIFA)
      6. 3.8.6  DDR2/mDDR Controller
      7. 3.8.7  Serial Peripheral Interface Modules (SPI)
      8. 3.8.8  Programmable Real-Time Unit (PRU)
      9. 3.8.9  Enhanced Capture/Auxiliary PWM Modules (eCAP0)
      10. 3.8.10 Enhanced Pulse Width Modulators (eHRPWM)
      11. 3.8.11 Boot
      12. 3.8.12 Universal Asynchronous Receiver/Transmitters (UART0, UART1, UART2)
      13. 3.8.13 Inter-Integrated Circuit Modules(I2C0, I2C1)
      14. 3.8.14 Timers
      15. 3.8.15 Multichannel Audio Serial Ports (McASP)
      16. 3.8.16 Multichannel Buffered Serial Ports (McBSP)
      17. 3.8.17 Universal Serial Bus Modules (USB0)
      18. 3.8.18 Ethernet Media Access Controller (EMAC)
      19. 3.8.19 Multimedia Card/Secure Digital (MMC/SD)
      20. 3.8.20 General Purpose Input Output
      21. 3.8.21 Reserved and No Connect
      22. 3.8.22 Supply and Ground
    9. 3.9 Unused Pin Configurations
  4. 4Device Configuration
    1. 4.1 Boot Modes
    2. 4.2 SYSCFG Module
    3. 4.3 Pullup/Pulldown Resistors
  5. 5Specifications
    1. 5.1 Absolute Maximum Ratings Over Operating Junction Temperature Range (Unless Otherwise Noted)
    2. 5.2 Handling Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Notes on Recommended Power-On Hours (POH)
    5. 5.5 Electrical Characteristics Over Recommended Ranges of Supply Voltage and Operating Junction Temperature (Unless Otherwise Noted)
  6. 6Peripheral Information and Electrical Specifications
    1. 6.1  Parameter Information
      1. 6.1.1 Parameter Information Device-Specific Information
        1. 6.1.1.1 Signal Transition Levels
    2. 6.2  Recommended Clock and Control Signal Transition Behavior
    3. 6.3  Power Supplies
      1. 6.3.1 Power-On Sequence
      2. 6.3.2 Power-Off Sequence
    4. 6.4  Reset
      1. 6.4.1 Power-On Reset (POR)
      2. 6.4.2 Warm Reset
      3. 6.4.3 Reset Electrical Data Timings
    5. 6.5  Crystal Oscillator or External Clock Input
    6. 6.6  Clock PLLs
      1. 6.6.1 PLL Device-Specific Information
      2. 6.6.2 Device Clock Generation
      3. 6.6.3 Dynamic Voltage and Frequency Scaling (DVFS)
    7. 6.7  Interrupts
      1. 6.7.1 ARM CPU Interrupts
        1. 6.7.1.1 ARM Interrupt Controller (AINTC) Interrupt Signal Hierarchy
        2. 6.7.1.2 AINTC Hardware Vector Generation
        3. 6.7.1.3 AINTC Hardware Interrupt Nesting Support
        4. 6.7.1.4 AINTC System Interrupt Assignments
        5. 6.7.1.5 AINTC Memory Map
      2. 6.7.2 DSP Interrupts
    8. 6.8  Power and Sleep Controller (PSC)
      1. 6.8.1 Power Domain and Module Topology
        1. 6.8.1.1 Power Domain States
        2. 6.8.1.2 Module States
    9. 6.9  Enhanced Direct Memory Access Controller (EDMA3)
      1. 6.9.1 EDMA3 Channel Synchronization Events
      2. 6.9.2 EDMA3 Peripheral Register Descriptions
    10. 6.10 External Memory Interface A (EMIFA)
      1. 6.10.1 EMIFA Asynchronous Memory Support
      2. 6.10.2 EMIFA Synchronous DRAM Memory Support
      3. 6.10.3 EMIFA SDRAM Loading Limitations
      4. 6.10.4 EMIFA Connection Examples
      5. 6.10.5 External Memory Interface Register Descriptions
      6. 6.10.6 EMIFA Electrical Data/Timing
        1. Table 6-21 Timing Requirements for EMIFA SDRAM Interface
        2. Table 6-22 Switching Characteristics for EMIFA SDRAM Interface
        3. Table 6-23 Timing Requirements for EMIFA Asynchronous Memory Interface
    11. 6.11 DDR2/mDDR Memory Controller
      1. 6.11.1 DDR2/mDDR Memory Controller Electrical Data/Timing
      2. 6.11.2 DDR2/mDDR Memory Controller Register Description(s)
      3. 6.11.3 DDR2/mDDR Interface
        1. 6.11.3.1  DDR2/mDDR Interface Schematic
        2. 6.11.3.2  Compatible JEDEC DDR2/mDDR Devices
        3. 6.11.3.3  PCB Stackup
        4. 6.11.3.4  Placement
        5. 6.11.3.5  DDR2/mDDR Keep Out Region
        6. 6.11.3.6  Bulk Bypass Capacitors
        7. 6.11.3.7  High-Speed Bypass Capacitors
        8. 6.11.3.8  Net Classes
        9. 6.11.3.9  DDR2/mDDR Signal Termination
        10. 6.11.3.10 VREF Routing
        11. 6.11.3.11 DDR2/mDDR CK and ADDR_CTRL Routing
        12. 6.11.3.12 DDR2/mDDR Boundary Scan Limitations
    12. 6.12 Memory Protection Units
    13. 6.13 MMC / SD / SDIO (MMCSD0, MMCSD1)
      1. 6.13.1 MMCSD Peripheral Description
      2. 6.13.2 MMCSD Peripheral Register Description(s)
      3. 6.13.3 MMC/SD Electrical Data/Timing
        1. Table 6-42 Timing Requirements for MMC/SD (see and )
        2. Table 6-43 Switching Characteristics for MMC/SD (see through )
    14. 6.14 Multichannel Audio Serial Port (McASP)
      1. 6.14.1 McASP Peripheral Registers Description(s)
      2. 6.14.2 McASP Electrical Data/Timing
        1. 6.14.2.1 Multichannel Audio Serial Port 0 (McASP0) Timing
          1. Table 6-47 Timing Requirements for McASP0 (1.2V, 1.1V)
          2. Table 6-48 Timing Requirements for McASP0 (1.0V)
          3. Table 6-49 Switching Characteristics for McASP0 (1.2V, 1.1V)
          4. Table 6-50 Switching Characteristics for McASP0 (1.0V)
    15. 6.15 Multichannel Buffered Serial Port (McBSP)
      1. 6.15.1 McBSP Peripheral Register Description(s)
      2. 6.15.2 McBSP Electrical Data/Timing
        1. 6.15.2.1 Multichannel Buffered Serial Port (McBSP) Timing
          1. Table 6-52 Timing Requirements for McBSP0 [1.2V, 1.1V] (see )
          2. Table 6-53 Timing Requirements for McBSP0 [1.0V] (see )
          3. Table 6-54 Switching Characteristics for McBSP0 [1.2V, 1.1V] (see )
          4. Table 6-55 Switching Characteristics for McBSP0 [1.0V] (see )
          5. Table 6-56 Timing Requirements for McBSP1 [1.2V, 1.1V] (see )
          6. Table 6-57 Timing Requirements for McBSP1 [1.0V] (see )
          7. Table 6-58 Switching Characteristics for McBSP1 [1.2V, 1.1V] (see )
          8. Table 6-59 Switching Characteristics for McBSP1 [1.0V] (see )
          9. Table 6-60 Timing Requirements for McBSP0 FSR When GSYNC = 1 (see )
          10. Table 6-61 Timing Requirements for McBSP1 FSR When GSYNC = 1 (see )
    16. 6.16 Serial Peripheral Interface Ports (SPI0, SPI1)
      1. 6.16.1 SPI Peripheral Registers Description(s)
      2. 6.16.2 SPI Electrical Data/Timing
        1. 6.16.2.1 Serial Peripheral Interface (SPI) Timing
          1. Table 6-63 General Timing Requirements for SPI0 Master Modes
          2. Table 6-64 General Timing Requirements for SPI0 Slave Modes
          3. Table 6-71 General Timing Requirements for SPI1 Master Modes
          4. Table 6-72 General Timing Requirements for SPI1 Slave Modes
          5. Table 6-73 Additional SPI1 Master Timings, 4-Pin Enable Option
          6. Table 6-74 Additional SPI1 Master Timings, 4-Pin Chip Select Option
    17. 6.17 Inter-Integrated Circuit Serial Ports (I2C)
      1. 6.17.1 I2C Device-Specific Information
      2. 6.17.2 I2C Peripheral Registers Description(s)
      3. 6.17.3 I2C Electrical Data/Timing
        1. 6.17.3.1 Inter-Integrated Circuit (I2C) Timing
          1. Table 6-80 Timing Requirements for I2C Input
          2. Table 6-81 Switching Characteristics for I2C
    18. 6.18 Universal Asynchronous Receiver/Transmitter (UART)
      1. 6.18.1 UART Peripheral Registers Description(s)
      2. 6.18.2 UART Electrical Data/Timing
        1. Table 6-83 Timing Requirements for UART Receive (see )
        2. Table 6-84 Switching Characteristics Over Recommended Operating Conditions for UARTx Transmit (see )
    19. 6.19 Universal Serial Bus OTG Controller (USB0) [USB2.0 OTG]
      1. 6.19.1 USB0 [USB2.0] Electrical Data/Timing
        1. Table 6-86 Switching Characteristics Over Recommended Operating Conditions for USB0 [USB2.0] (see )
    20. 6.20 Ethernet Media Access Controller (EMAC)
      1. 6.20.1 EMAC Peripheral Register Description(s)
        1. 6.20.1.1 EMAC Electrical Data/Timing
          1. Table 6-91 Timing Requirements for MII_RXCLK (see )
          2. Table 6-92 Timing Requirements for MII_TXCLK (see )
          3. Table 6-93 Timing Requirements for EMAC MII Receive 10/100 Mbit/s (see )
          4. Table 6-94 Switching Characteristics Over Recommended Operating Conditions for EMAC MII Transmit 10/100 Mbit/s (see )
    21. 6.21 Management Data Input/Output (MDIO)
      1. 6.21.1 MDIO Register Description(s)
      2. 6.21.2 Management Data Input/Output (MDIO) Electrical Data/Timing
        1. Table 6-98 Timing Requirements for MDIO Input (see and )
        2. Table 6-99 Switching Characteristics Over Recommended Operating Conditions for MDIO Output (see )
    22. 6.22 Enhanced Capture (eCAP) Peripheral
      1. Table 6-101 Timing Requirements for Enhanced Capture (eCAP)
      2. Table 6-102 Switching Characteristics Over Recommended Operating Conditions for eCAP
    23. 6.23 Enhanced High-Resolution Pulse-Width Modulator (eHRPWM)
      1. 6.23.1 Enhanced Pulse Width Modulator (eHRPWM) Timing
        1. Table 6-104 Timing Requirements for eHRPWM
        2. Table 6-105 Switching Characteristics Over Recommended Operating Conditions for eHRPWM
      2. 6.23.2 Trip-Zone Input Timing
    24. 6.24 Timers
      1. 6.24.1 Timer Electrical Data/Timing
        1. Table 6-107 Timing Requirements for Timer Input (see )
        2. Table 6-108 Switching Characteristics Over Recommended Operating Conditions for Timer Output
    25. 6.25 Real Time Clock (RTC)
      1. 6.25.1 Clock Source
      2. 6.25.2 Real-Time Clock Register Descriptions
    26. 6.26 General-Purpose Input/Output (GPIO)
      1. 6.26.1 GPIO Register Description(s)
      2. 6.26.2 GPIO Peripheral Input/Output Electrical Data/Timing
        1. Table 6-111 Timing Requirements for GPIO Inputs (see )
        2. Table 6-112 Switching Characteristics Over Recommended Operating Conditions for GPIO Outputs (see )
      3. 6.26.3 GPIO Peripheral External Interrupts Electrical Data/Timing
        1. Table 6-113 Timing Requirements for External Interrupts (see )
    27. 6.27 Programmable Real-Time Unit Subsystem (PRUSS)
      1. 6.27.1 PRUSS Register Descriptions
    28. 6.28 Emulation Logic
      1. 6.28.1 JTAG Port Description
      2. 6.28.2 Scan Chain Configuration Parameters
      3. 6.28.3 Initial Scan Chain Configuration
        1. 6.28.3.1 Adding TAPS to the Scan Chain
      4. 6.28.4 IEEE 1149.1 JTAG
        1. 6.28.4.1 JTAG Peripheral Register Description(s) – JTAG ID Register (DEVIDR0)
        2. 6.28.4.2 JTAG Test-Port Electrical Data/Timing
          1. Table 6-125 Timing Requirements for JTAG Test Port (see )
          2. Table 6-126 Switching Characteristics Over Recommended Operating Conditions for JTAG Test Port (see )
      5. 6.28.5 JTAG 1149.1 Boundary Scan Considerations
  7. 7Device and Documentation Support
    1. 7.1 Device Nomenclature
    2. 7.2 Tools and Software
    3. 7.3 Documentation Support
    4. 7.4 Community Resources
    5. 7.5 商標
    6. 7.6 静電気放電に関する注意事項
    7. 7.7 Export Control Notice
    8. 7.8 Glossary
  8. 8Mechanical Packaging and Orderable Information
    1. 8.1 Thermal Data for ZWT Package
    2. 8.2 Packaging Information

パッケージ・オプション

デバイスごとのパッケージ図は、PDF版データシートをご参照ください。

メカニカル・データ（パッケージ｜ピン）
  • ZWT|361
サーマルパッド・メカニカル・データ
発注情報

7.1 Device Nomenclature

To designate the stages in the product development cycle, TI assigns prefixes to the part numbers of all DSP devices and support tools. Each DSP commercial family member has one of three prefixes: X, P or NULL (e.g., OMAP-L132). Texas Instruments recommends two of three possible prefix designators for its support tools: TMDX and TMDS. These prefixes represent evolutionary stages of product development from engineering prototypes (TMX/TMDX) through fully qualified production devices/tools (TMS/TMDS).

Device development evolutionary flow:

    X Experimental device that is not necessarily representative of the final device's electrical specifications.
    P Final silicon die that conforms to the device's electrical specifications but has not completed quality and reliability verification.
    NULL Fully-qualified production device.

Support tool development evolutionary flow:

    TMDX Development-support product that has not yet completed Texas Instruments internal qualification testing.
    TMDS Fully qualified development-support product.

X and P devices and TMDX development-support tools are shipped against the following disclaimer:

"Developmental product is intended for internal evaluation purposes."

Null devices and TMDS development-support tools have been characterized fully, and the quality and reliability of the device have been demonstrated fully. TI's standard warranty applies.

Predictions show that prototype devices (X or P) have a greater failure rate than the standard production devices. Texas Instruments recommends that these devices not be used in any production system because their expected end-use failure rate still is undefined. Only qualified production devices are to be used.

TI device nomenclature also includes a suffix with the device family name. This suffix indicates the package type (for example, ZWT), the temperature range (for example, "Blank" is the commercial temperature range), and the device speed range in megahertz (for example, "Blank" is the default).

Figure 7-1 provides a legend for reading the complete device.

OMAP-L132 nomen_L132_prs762.gif
A. BGA = Ball Grid Array
Figure 7-1 Device Nomenclature