JAJSMH3B December   1997  – November 2024 OPA134 , OPA2134 , OPA4134

PRODUCTION DATA  

  1.   1
  2. 1 特長
  3. 2 アプリケーション
  4. 3 概要
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information - OPA134
    5. 5.5 Thermal Information - OPA2134
    6. 5.6 Thermal Information - OPA4134
    7. 5.7 Electrical Characteristics
    8. 5.8 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Feature Description
      1. 6.2.1 Total Harmonic Distortion
      2. 6.2.2 Distortion Measurements
      3. 6.2.3 Source Impedance and Distortion
      4. 6.2.4 Phase Reversal Protection
      5. 6.2.5 Output Current Limit
    3. 6.3 Functional Block Diagram
    4. 6.4 Device Functional Modes
      1. 6.4.1 Noise Performance
  8. 7 Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Operating Voltage
      2. 7.1.2 Offset Voltage Trim
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
      3. 7.2.3 Application Curve
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 Development Support
        1. 8.1.1.1 Analog Filter Designer
        2. 8.1.1.2 TINA-TI™シミュレーション ソフトウェア (無償ダウンロード)
        3. 8.1.1.3 TI のリファレンス・デザイン
    2. 8.2 Documentation Support
      1. 8.2.1 Related Documentation
    3. 8.3 ドキュメントの更新通知を受け取る方法
    4. 8.4 サポート・リソース
    5. 8.5 Trademarks
    6. 8.6 静電気放電に関する注意事項
    7. 8.7 用語集
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

5.4 Thermal Information - OPA134

THERMAL METRIC(1) OPA134 UNIT
D (SOIC) P (PDIP)
8 PINS 8 PINS
RθJA Junction-to-ambient thermal resistance  160 73 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 75 50 °C/W
RθJB Junction-to-board thermal resistance 60 36 °C/W
ΨJT Junction-to-top characterization parameter 9 17 °C/W
ΨJB Junction-to-board characterization parameter 50 35 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A N/A °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.