JAJSMD4E December   2003  – August 2023 OPA1632

PRODUCTION DATA  

  1.   1
  2. 1 特長
  3. 2 アプリケーション
  4. 3 概要
  5. 4 Revision History
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
    4. 7.4 Device Functional Modes
      1. 7.4.1 Shutdown Function
  9. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Output Common-Mode Voltage
        1. 8.1.1.1 Resistor Matching
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
        1. 8.4.1.1 PowerPAD™ Integrated Circuit Package Design Considerations
        2. 8.4.1.2 Power Dissipation and Thermal Considerations
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 ドキュメントの更新通知を受け取る方法
    3. 9.3 サポート・リソース
    4. 9.4 Trademarks
    5. 9.5 静電気放電に関する注意事項
    6. 9.6 用語集
  11. 10Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

5 Pin Configuration and Functions

GUID-9EA49440-4E63-4201-9E05-AF11A1D89DE3-low.gif Figure 5-1 D Package, 8-Pin SOIC or
DGN Package(1), 8-Pin HVSSOP
(Top View)
Table 5-1 Pin Functions
PIN TYPE(2) DESCRIPTION
NAME NO.
Enable 7 I Active high enable pin
V+ 3 I/O Positive supply voltage pin
V– 6 I/O Negative supply voltage pin
VIN+ 8 I Positive input voltage pin
VIN– 1 I Negative input voltage pin
VOCM 2 I Output common-mode control voltage pin
VOUT+ 4 O Positive output voltage pin
VOUT– 5 O Negative output voltage pin
(1) Solder the exposed DGN (HVSSOP) package thermal pad to a heat-spreading power or ground plane. This pad is electrically isolated from the die, but must be connected to a power or ground plane and not floated.
(2) I = input, O = output.