JAJSH26C March   2019  – September 2022 OPA1655 , OPA1656

PRODUCTION DATA  

  1. 1 特長
  2. 2 アプリケーション
  3. 3 概要
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information: OPA1655
    5. 6.5 Thermal Information: OPA1656
    6. 6.6 Electrical Characteristics
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Phase Reversal Protection
      2. 7.3.2 Electrical Overstress
      3. 7.3.3 EMI Rejection Ratio (EMIRR)
        1. 7.3.3.1 EMIRR IN+ Test Configuration
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Basic Noise Calculations
    2. 8.2 Typical Applications
      1. 8.2.1 Preamplifier Circuit for Vinyl Record Playback With Moving-Magnet Phono Cartridges
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curves
      2. 8.2.2 Composite Headphone Amplifier
        1. 8.2.2.1 Application Curves
      3. 8.2.3 Baxandall Tone Control
        1. 8.2.3.1 Application Curves
      4. 8.2.4 Guitar Input to XLR Output
        1. 8.2.4.1 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
        1. 8.4.1.1 Power Dissipation
      2. 8.4.2 Layout Example
  9. 9 Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Development Support
        1. 9.1.1.1 PSpice® for TI
        2. 9.1.1.2 TINA-TI™シミュレーション・ソフトウェア (無償ダウンロード)
        3. 9.1.1.3 DIP アダプタ評価基板
        4. 9.1.1.4 DIYAMP-EVM
        5. 9.1.1.5 TI のリファレンス・デザイン
        6. 9.1.1.6 フィルタ設計ツール
    2. 9.2 Documentation Support
      1. 9.2.1 Related Documentation
    3. 9.3 Receiving Notification of Documentation Updates
    4. 9.4 サポート・リソース
    5. 9.5 Trademarks
    6. 9.6 Electrostatic Discharge Caution
    7. 9.7 Glossary
  10. 10Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

6.4 Thermal Information: OPA1655

THERMAL METRIC(1) OPA1655 UNIT
D (SOIC) DBV (SOT23)
8 PINS 5 PINS
RθJA Junction-to-ambient thermal resistance 120.9 143.4 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 58.9 68.4 °C/W
RθJB Junction-to-board thermal resistance 65.1 39.2 °C/W
ψJT Junction-to-top characterization parameter 13.5 20.4 °C/W
ψJB Junction-to-board characterization parameter 64.2 39.0 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A N/A °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.