JAJSFN7E November 2011 – June 2018 OPA180 , OPA2180 , OPA4180
PRODUCTION DATA.
THERMAL METRIC(1) | OPA4180 | UNIT | ||
---|---|---|---|---|
D (SOIC) | PW (TSSOP) | |||
14 PINS | 14 PINS | |||
RθJA | Junction-to-ambient thermal resistance | 93.2 | 106.9 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 51.8 | 24.4 | °C/W |
RθJB | Junction-to-board thermal resistance | 49.4 | 59.3 | °C/W |
ψJT | Junction-to-top characterization parameter | 13.5 | 0.6 | °C/W |
ψJB | Junction-to-board characterization parameter | 42.2 | 54.3 | °C/W |
RθJC(bot) | Junction-to-case (bottom) thermal resistance | N/A | N/A | °C/W |