JAJSEY7C January 2016 – March 2018 OPA197 , OPA2197 , OPA4197
PRODUCTION DATA.
THERMAL METRIC(1) | OPA4197 | UNIT | ||
---|---|---|---|---|
D (SOIC) | PW (TSSOP) | |||
14 PINS | 14 PINS | |||
RθJA | Junction-to-ambient thermal resistance | 86.4 | 92.6 | °C/W |
RθJC(top) | Junction-to-case(top) thermal resistance | 46.3 | 27.5 | °C/W |
RθJB | Junction-to-board thermal resistance | 41.0 | 33.6 | °C/W |
ψJT | Junction-to-top characterization parameter | 11.3 | 1.9 | °C/W |
ψJB | Junction-to-board characterization parameter | 40.7 | 33.1 | °C/W |
RθJC(bot) | Junction-to-case(bottom) thermal resistance | N/A | N/A | °C/W |