JAJS198L October 2006 – January 2020 OPA211
PRODUCTION DATA.
THERMAL METRIC(1) | OPA2211, OPA2211A | UNIT | ||||
---|---|---|---|---|---|---|
DDA
(SO-PowerPAD) |
DRG (SON) | |||||
8 PINS | 8 PINS | |||||
RθJA | Junction-to-ambient thermal resistance, high-K board | 50.4 | 125 | °C/W | ||
RθJC(top) | Junction-to-case (top) thermal resistance | N/A | N/A | °C/W | ||
RθJB | Junction-to-board thermal resistance | 13 | 28.8 | °C/W | ||
ψJT | Junction-to-top characterization parameter | 5.2 | 3 | °C/W | ||
ψJB | Junction-to-board characterization parameter | 11.7 | 25 | °C/W | ||
RθJC(bot) | Junction-to-case (bottom) thermal resistance | 1.1 | 19.1 | °C/W |