JAJSG31B September   2018  – June 2019 OPA2156

PRODUCTION DATA.  

  1. 1 特長
  2. 2 アプリケーション
  3. 3 概要
    1.     Device Images
      1.      入力電圧のノイズ・スペクトル密度が低い
      2.      OPA2156 トランスインピーダンス構成
  4. 4 改訂履歴
  5. 5 概要（続き）
  6. 6 Pin Configuration and Functions
    1.     Pin Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information: OPA2156
    5. 7.5 Electrical Characteristics
    6. 7.6 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Phase Reversal Protection
      2. 8.3.2 Electrical Overstress
      3. 8.3.3 Thermal Considerations
      4. 8.3.4 Thermal Shutdown
      5. 8.3.5 Common-Mode Voltage Range
      6. 8.3.6 Overload Recovery
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Slew Rate Limit for Input Protection
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 Power Dissipation
    2. 11.2 Layout Example
  12. 12デバイスおよびドキュメントのサポート
    1. 12.1 デバイス・サポート
      1. 12.1.1 開発サポート
        1. 12.1.1.1 TINA-TI(無料のダウンロード・ソフトウェア)
        2. 12.1.1.2 TI Precision Designs
    2. 12.2 ドキュメントのサポート
      1. 12.2.1 関連資料
    3. 12.3 ドキュメントの更新通知を受け取る方法
    4. 12.4 コミュニティ・リソース
    5. 12.5 商標
    6. 12.6 静電気放電に関する注意事項
    7. 12.7 Glossary
  13. 13メカニカル、パッケージ、および注文情報

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

8.3.3 Thermal Considerations

Through normal operation the OPA2156 will experience self-heating, a natural increase in the die junction temperature which occurs in every amplifier. This is a result of several factors including the quiescent power consumption, the package’s thermal dissipation, PCB layout and the device operating conditions.

To fully ensure the amplifier will operate without entering thermal shutdown it is important to calculate the approximate junction (die) temperature which can be done using Equation 1.

Equation 1. OPA2156 Eq1-JunctionTemp.gif

Equation 2 shows the approximate junction temperature for the OPA2156 while unloaded with an ambient temperature of 25°C.

Equation 2. OPA2156 Eq1-JunctionTemp-Calc.gif

For high voltage, high precision amplifiers such as the OPA2156 the junction temperature can easily be 10s of degrees higher than the ambient temperature in a quiescent (unloaded) condition. If the device then begins to drive a heavy load the junction temperature may rise and trip the thermal shutdown circuit. The Figure 44 shows the maximum output voltage of the OPA2156 without entering thermal shutdown vs ambient temperature in both a loaded and unloaded condition.

OPA2156 OPA2156 Thermal SOA.gifFigure 44. OPA2156 Thermal Safe Operating Area