4 改訂履歴
Changes from H Revision (September 2015) to I Revision
- Changed supply voltage values within Absolute Maximum Ratings tableGo
Changes from G Revision (June 2015) to H Revision
- OPA2172デバイスにDRGパッケージを追加Go
- 「特長」の最後の箇条書き項目にWSONを追加Go
- 「製品情報」表にOPA2172 WSONの行を追加Go
- Added WSON-8 to OPA2172 row of Device Comparison table Go
- Added DRG pinout drawing Go
- Added DRG column to OPA2172 and OPA4172 Pin Functions table Go
- Added DRG column to OPA2172 Thermal Information table Go
Changes from F Revision (June 2015) to G Revision
- Added input bias current (IB) values for DGK and PW packages.Go
Changes from E Revision (December 2014) to F Revision
- デバイスのステータスを「量産データ」から「混在ステータス」に変更Go
- OPA2172 DGKおよびOPA4172 PWパッケージを量産データに変更Go
- 「製品情報」表にOPA2172 VSSOPおよびOPA4172 TSSOPの行を追加Go
- Deleted footnote from Device Comparison tableGo
- Deleted footnote from OPA2172 DGK and OPA4172 PW pin out drawings Go
- Added OPA2172 DGK thermal information Go
Changes from D Revision (September 2014) to E Revision
- OPA2172 Dパッケージを製品プレビューから量産データに変更Go
- 「製品情報」表を変更Go
- Changed Device Comparison table note (1) to show preview packagesGo
- Changed Handling Ratings table to ESD Ratings tableGo
Changes from C Revision (July 2014) to D Revision
- 特長の低ノイズの箇条書き項目を6nV/√Hzから7に変更Go
- 特長の箇条書き項目でMSOPをVSSOPに変更Go
- 「製品情報」表にパッケージと新しい注2を追加Go
- Changed OPAx172 voltage noise density from 6 nV/√Hz to 7 in Device Family Comparison table Go
- Changed OPA4172 package from DGK to PW in Pin Functions tableGo
- Added OPA2172 Thermal Information tableGo
- Changed input voltage noise value in Electrical Characteristics from 1.2 µVPP to 2.5 µVPPGo
- Changed input voltage noise density value at 100 Hz in Electrical Characteristics from 8.6 nV/√Hz to 12Go
- Changed input voltage noise density value at 1 kHz in Electrical Characteristics from 6 nV/√Hz to 7Go
- Changed voltage output swing values in the Electrical CharacteristicsGo
- Changed Figure 13Go
- Changed Figure 14Go
- Added new note to Applications and Implementation section Go
Changes from B Revision (May 2014) to C Revision
- OPA4172 Dパッケージ(SOIC-14)を製品プレビューから量産データに変更Go
- Added OPA4172-D Thermal information Go
- Added Channel separation parameter to the Electrical CharacteristicsGo
- Added Channel Separation vs Frequency plot Go
Changes from A Revision (April 2014) to B Revision
- DCK (SC70)パッケージを製品プレビューから量産データに変更Go
Changes from * Revision (December 2013) to A Revision
- 最新のデータシート標準に合わせてドキュメントのフォーマットを変更、「取り扱い定格」セクション、「推奨動作条件」セクション、「デバイスおよびドキュメントのサポート」セクションを追加、既存のセクションを移動Go
- Changed DCK package pin names from IN+ and IN– to +IN and –IN, respectively Go
- Changed DBV package from product preview to production dataGo
- Changed Figure 9Go
- Added Functional Block Diagram sectionGo
- Added Capacitive Load Drive Solution Using an Isolation Resistor sectionGo
- Added Power-Supply Recommendations sectionGo
- ChangedLayout Guidelines sectionGo