10.1 Layout Guidelines
For best operational performance of the device, use good printed circuit board (PCB) layout practices, including:
- Low-ESR, 0.1-µF ceramic bypass capacitors must be connected between each supply pin and ground; place the capacitors as close to the device as possible. A single bypass capacitor from V+ to ground is applicable to single-supply applications.
- To reduce parasitic coupling, run the input traces as far away from the supply lines as possible.
- A ground plane helps distribute heat and reduces EMI noise pickup.
- Place the external components as close to the device as possible. This configuration prevents parasitic errors (such as the Seebeck effect) from occurring.
- Consider a driven, low-impedance guard ring around the critical traces. A guard ring can significantly reduce leakage currents from nearby traces that are at different potentials.