SBOS432G August   2008  – August 2016 OPA2330 , OPA330 , OPA4330

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configurations and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information: OPA330
    5. 7.5 Thermal Information: OPA2330
    6. 7.6 Thermal Information: OPA4330
    7. 7.7 Electrical Characteristics
    8. 7.8 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Operating Voltage
      2. 9.1.2 Input Voltage
      3. 9.1.3 Input Differential Voltage
      4. 9.1.4 Internal Offset Correction
      5. 9.1.5 EMI Susceptibility and Input Filtering
      6. 9.1.6 Achieving Output Swing to the Operational Amplifier Negative Rail
      7. 9.1.7 Photosensitivity
    2. 9.2 Typical Application
      1. 9.2.1 Bidirectional Current-Sensing
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
        3. 9.2.1.3 Application Curve
    3. 9.3 System Examples
      1. 9.3.1 Single Operational Amplifier Bridge Amplifier
      2. 9.3.2 Low-Side Current Monitor
      3. 9.3.3 Thermistor Measurement
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 VQFN and SON Packages
      2. 11.1.2 VQFN and SON Layout Guidelines
      3. 11.1.3 OPA330 DSBGA
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Development Support
        1. 12.1.1.1 TINA-TI™ (Free Software Download)
        2. 12.1.1.2 DIP Adapter EVM
        3. 12.1.1.3 Universal Operational Amplifier EVM
        4. 12.1.1.4 TI Precision Designs
        5. 12.1.1.5 WEBENCH Filter Designer
        6. 12.1.1.6 Related Parts
    2. 12.2 Documentation Support
      1. 12.2.1 Related Documentation
    3. 12.3 Related Links
    4. 12.4 Receiving Notification of Documentation Updates
    5. 12.5 Community Resources
    6. 12.6 Trademarks
    7. 12.7 Electrostatic Discharge Caution
    8. 12.8 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

パッケージ・オプション

デバイスごとのパッケージ図は、PDF版データシートをご参照ください。

メカニカル・データ（パッケージ｜ピン）
  • D|8
  • DGK|8
  • DRB|8
サーマルパッド・メカニカル・データ
発注情報

1 Features

  • Unmatched Price Performance
  • Low Offset Voltage: 50 µV (Maximum)
  • Zero Drift: 0.25 µV/°C (Maximum)
  • Low Noise: 1.1 µVPP, 0.1 Hz to 10 Hz
  • Quiescent Current: 35 µA (Maximum)
  • Supply Voltage: 1.8 V to 5.5 V
  • Rail-to-Rail Input and Output
  • Internal EMI Filtering
  • microSize Packages: DSBGA, SC70, VQFN

2 Applications

  • Battery-Powered Instruments
  • Temperature Measurements
  • Transducer Applications
  • Electronic Scales
  • Medical Instrumentation
  • Handheld Test Equipment
  • Current Sense

    • Bidirectional, Low-Side Current Sense

    OPA330 OPA2330 OPA4330 fp_schematic_bos432.gif

3 Description

The OPA330 series of CMOS operational amplifiers offer precision performance at a very competitive price. These devices are members of the Zero-Drift family of amplifiers which use a proprietary auto-calibration technique to simultaneously provide low offset voltage (50-μV maximum) and near-zero drift over time and temperature at only 35 μA (maximum) of quiescent current. The OPA330 family features rail-to-rail input and output in addition to near-flat 1/f noise, making this amplifier ideal for many applications and much easier to design into a system. These devices are optimized for low-voltage operation as low as 1.8 V (±0.9 V) and up to 5.5 V (±2.75 V).

The OPA330 (single version) is available in the 5-pin DSBGA, 5-pin SC70, 5-pin SOT-23, and 8-pin SOIC packages. The OPA2330 (dual version) is offered in 3 mm × 3 mm, 8-pin SON, 8-pin VSSOP, and 8-pin SOIC packages. The OPA4330 is offered in the standard 14-pin SOIC and 14-pin TSSOP packages, as well as in the space-saving 14-pin VQFN package. All versions are specified for operation from –40°C to 125°C.

Device Information(1)

PART NUMBER PACKAGE BODY SIZE (NOM)
OPA330 SOIC (8) 4.90 mm × 3.91 mm
SOT (5) 2.90 mm × 1.60 mm
SC70 (5) 2.00 mm × 1.25 mm
DSBGA (5) 0.00 mm × 0.00 mm
OPA2330 SOIC (8) 4.90 mm × 3.91 mm
VSSOP (8) 3.00 mm × 3.00 mm
SON (8) 3.00 mm × 3.00 mm
OPA4330 SOIC (14) 8.65 mm × 3.91 mm
TSSOP (14) 5.00 mm × 4.40 mm
VQFN (14) 3.50 mm × 3.50 mm
  1. For all available packages, see the orderable addendum at the end of the data sheet.

4 Revision History

Changes from F Revision (June 2016) to G Revision

  • Changed Pin Functions: OPA330 so each pin has a separate rowGo
  • Changed position of Input Voltage Range, CMRR parameter specification values in Electrical Characteristics tableGo
  • Changed position of Open-Loop Gain, AOL parameter specification values in Electrical Characteristics tableGo

Changes from E Revision (February 2011) to F Revision

  • Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section Go
  • Added current package designators to second paragraph of Description section Go
  • Removed Package Information table, see POA at the end of the datasheetGo
  • Changed Product Family Package Comparison table to Device Comparison table; moved from page 1 of documentGo

Changes from D Revision (June 2010) to E Revision

  • Changed document status from Mixed Status to Production DataGo
  • Deleted footnote 2 from the Package Information tableGo
  • Added remaining thermal information dataGo

Changes from C Revision (October 2009) to D Revision

  • Added last Applications bulletGo
  • Deleted footnote 2 and shading from all packages except QFN-14; moved WCSP-5, SOIC-14, and TSSOP-14 packages to Production Data status; and added package marking information to Package Information tableGo
  • Deleted footnote 1 from Product Family Package Comparison tableGo
  • Moved TSSOP-14 thermal resistance to MSOP-8, SOIC-8 thermal resistance parameter in Electrical Characteristics tableGo
  • Deleted SOIC-14 and QFN-14 rows from Temperature Range section in Electrical Characteristics tableGo
  • Added OPA330YFF, OPA4330 Input Bias Current parameter to Electrical Characteristics tableGo
  • Added Input Voltage Range, OPA330YFF, OPA4330 Common-Mode Rejection Ratio parameter to Electrical Characteristics tableGo