JAJSIN9B December 2008 – February 2020 OPA2333-Q1
PRODUCTION DATA.
THERMAL METRIC(1) | OPA2333-Q1 | UNIT | ||
---|---|---|---|---|
D (SOIC) | DGK (VSSOP) | |||
8 PINS | 8 PINS | |||
RθJA | Junction-to-ambient thermal resistance | 124.0 | 180.3 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 73.7 | 48.1 | °C/W |
RθJB | Junction-to-board thermal resistance | 64.4 | 100.9 | °C/W |
ψJT | Junction-to-top characterization parameter | 18.0 | 2.4 | °C/W |
ψJB | Junction-to-board characterization parameter | 63.9 | 99.3 | °C/W |
RθJC(bot) | Junction-to-case (bottom) thermal resistance | N/A | N/A | °C/W |