JAJSFB5E March   2001  – April 2018 OPA2355 , OPA3355 , OPA355

PRODUCTION DATA.  

  1. 1 特長
  2. 2 アプリケーション
  3. 3 概要
    1.     Device Images
      1.      概略回路図
  4. 4 改訂履歴
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
    1.     Pin Functions: OPA355
    2.     Pin Functions: OPA2355
    3.     Pin Functions: OPA3355
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information: OPA355
    5. 7.5 Thermal Information: OPA2355
    6. 7.6 Thermal Information: OPA3355
    7. 7.7 Electrical Characteristics: VS = 2.7 V to 5.5 V (Single-Supply)
    8. 7.8 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Operating Voltage
      2. 8.3.2 Enable Function
      3. 8.3.3 Output Drive
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 Transimpedance Amplifier
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
          1. 9.2.1.2.1 Optimizing The Transimpedance Circuit
        3. 9.2.1.3 Application Curve
      2. 9.2.2 High-Impedance Sensor Interface
      3. 9.2.3 Driving ADCs
      4. 9.2.4 Active Filter
    3. 9.3 Video
    4. 9.4 Wideband Video Multiplexing
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12デバイスおよびドキュメントのサポート
    1. 12.1 関連リンク
    2. 12.2 ドキュメントの更新通知を受け取る方法
    3. 12.3 コミュニティ・リソース
    4. 12.4 商標
    5. 12.5 静電気放電に関する注意事項
    6. 12.6 Glossary
  13. 13メカニカル、パッケージ、および注文情報

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

7.4 Thermal Information: OPA355

THERMAL METRIC(1) OPA355 UNIT
D (SOIC) DBV (SOT-23)
8 PINS 6 PINS
RθJA Junction-to-ambient thermal resistance 136.3 166.1 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 76.7 104.3 °C/W
RθJB Junction-to-board thermal resistance 79.8 38.7 °C/W
ψJT Junction-to-top characterization parameter 26.3 23.4 °C/W
ψJB Junction-to-board characterization parameter 79 38.5 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance — — °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.