JAJSCD4 August 2016 OPA657-DIE
PRODUCTION DATA.
DIE THICKNESS | BACKSIDE FINISH | BACKSIDE POTENTIAL |
BOND PAD METALLIZATION COMPOSITION |
BOND PAD THICKNESS |
---|---|---|---|---|
15 mils. | Silicon with backgrind | VS- | TiW/AlCu (0.5%) | 1100 nm |
DESCRIPTION | PAD NUMBER | X MIN | Y MIN | X MAX | Y MAX |
---|---|---|---|---|---|
Inverting input | 1 | 27 | 623 | 127 | 723 |
NonInverting input | 2 | 27 | 53 | 127 | 153 |
N/C | 3 | 181 | 53 | 281 | 153 |
Output | 4 | 723 | 27 | 823 | 127 |
VS– | 5 | 723 | 337 | 823 | 439 |
VS+ | 6 | 723 | 649 | 823 | 749 |
N/C | 7 | 181 | 623 | 281 | 723 |