To achieve the levels of high-frequency performance of the OPAx892, follow proper printed-circuit board (PCB), high-frequency design techniques. The following is a general set of guidelines. In addition, a OPAx892 evaluation board is available to use as a guide for layout or for evaluating the device performance.

• Ground planes—ensure that the ground plane used on the board provides all components with a low-inductive ground connection. However, in the areas of the amplifier inputs and output, the ground plane can be removed to minimize stray capacitance.
• Proper power-supply decoupling—use a 6.8‑μF tantalum capacitor in parallel with a 0.1‑μF ceramic capacitor on each supply pin. Sharing the tantalum capacitor among several amplifiers is possible depending on the application, but always use a 0.1‑μF ceramic capacitor on the supply pin of every amplifier. In addition, place the 0.1‑μF capacitor as close as possible to the supply pin. As this distance increases, the inductance in the connecting trace makes the capacitor less effective. Strive for distances of less than 0.1 inch (2.54 mm) between the device power pins and the ceramic capacitors.
• Short trace runs or compact part placements—optimized high-frequency performance is achieved when stray series inductance has been minimized. To realize this, make the circuit layout as compact as possible, thereby minimizing the length of all trace runs. Pay particular attention to the inputs of the amplifier, keeping the trace lengths as short as possible. This layout helps to minimize stray capacitance at the input of the amplifier.