JAJSQK2A November 2023 – July 2024 OPA2892 , OPA892
PRODUCTION DATA
デバイスごとのパッケージ図は、PDF版データシートをご参照ください。
PIN | TYPE | DESCRIPTION | |
---|---|---|---|
NAME | NO. | ||
IN– | 2 | Input | Inverting input |
IN+ | 3 | Input | Noninverting input |
NC | 5 | — | No connection |
NULL | 1, 8 | Input | Voltage offset adjust |
OUT | 6 | Output | Output of amplifier |
VCC– | 4 | — | Negative power supply |
VCC+ | 7 | — | Positive power supply |
PIN | TYPE | DESCRIPTION | |
---|---|---|---|
NAME | NO. | ||
1IN– | 2 | Input | Channel 1 inverting input |
1IN+ | 3 | Input | Channel 1 noninverting input |
1OUT | 1 | Output | Channel 1 output |
2IN– | 6 | Input | Channel 2 inverting input |
2IN+ | 5 | Input | Channel 2 noninverting input |
2OUT | 7 | Output | Channel 2 output |
VCC– | 4 | — | Negative power supply |
VCC+ | 8 | — | Positive power supply |
Thermal pad | — | Thermal pad. DGN (HVSSOP) package only. For best thermal performance, connect pad to large copper plane. Thermal pad can be connected to any pin on the device, or any other potential on the board if voltage on thermal pad remains between VCC+ and VCC–. |