JAJSQK2A November 2023 – July 2024 OPA2892 , OPA892
PRODUCTION DATA
デバイスごとのパッケージ図は、PDF版データシートをご参照ください。
THERMAL METRIC(1) | OPA892 | OPA2892 | UNIT | |
---|---|---|---|---|
D (SOIC) | DGN (HVSSOP) | |||
8 PINS | 8 PINS | |||
RθJA | Junction-to-ambient thermal resistance | 124.5 | 52 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 65.0 | 75.2 | °C/W |
RθJB | Junction-to-board thermal resistance | 72.2 | 24.5 | °C/W |
ΨJT | Junction-to-top characterization parameter | 13.6 | 4 | °C/W |
ΨJB | Junction-to-board characterization parameter | 71.4 | 24.5 | °C/W |
RθJC(bot) | Junction-to-case (bottom) thermal resistance | N/A | 9.1 | °C/W |