SBOS681C July   2014  – November 2017 OPT3001

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
    1.     Spectral Response: The OPT3001 and Human Eye
  3. 3 Description
    1.     Block Diagram
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Human Eye Matching
      2. 7.3.2 Automatic Full-Scale Range Setting
      3. 7.3.3 Interrupt Operation, INT Pin, and Interrupt Reporting Mechanisms
      4. 7.3.4 I2C Bus Overview
        1. 7.3.4.1 Serial Bus Address
        2. 7.3.4.2 Serial Interface
    4. 7.4 Device Functional Modes
      1. 7.4.1 Automatic Full-Scale Setting Mode
      2. 7.4.2 Interrupt Reporting Mechanism Modes
        1. 7.4.2.1 Latched Window-Style Comparison Mode
        2. 7.4.2.2 Transparent Hysteresis-Style Comparison Mode
        3. 7.4.2.3 End-of-Conversion Mode
        4. 7.4.2.4 End-of-Conversion and Transparent Hysteresis-Style Comparison Mode
    5. 7.5 Programming
      1. 7.5.1 Writing and Reading
        1. 7.5.1.1 High-Speed I2C Mode
        2. 7.5.1.2 General-Call Reset Command
        3. 7.5.1.3 SMBus Alert Response
    6. 7.6 Register Maps
      1. 7.6.1 Internal Registers
        1. 7.6.1.1 Register Descriptions
          1. 7.6.1.1.1 Result Register (offset = 00h)
            1. Table 7. Result Register Field Descriptions
          2. 7.6.1.1.2 Configuration Register (offset = 01h) [reset = C810h]
            1. Table 10. Configuration Register Field Descriptions
          3. 7.6.1.1.3 Low-Limit Register (offset = 02h) [reset = C0000h]
            1. Table 11. Low-Limit Register Field Descriptions
          4. 7.6.1.1.4 High-Limit Register (offset = 03h) [reset = BFFFh]
            1. Table 13. High-Limit Register Field Descriptions
          5. 7.6.1.1.5 Manufacturer ID Register (offset = 7Eh) [reset = 5449h]
            1. Table 14. Manufacturer ID Register Field Descriptions
          6. 7.6.1.1.6 Device ID Register (offset = 7Fh) [reset = 3001h]
            1. Table 15. Device ID Register Field Descriptions
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Electrical Interface
      2. 8.1.2 Optical Interface
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Optomechanical Design
        2. 8.2.2.2 Dark Window Selection and Compensation
      3. 8.2.3 Application Curves
    3. 8.3 Do's and Don'ts
  9. 9 Power-Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information
    1. 12.1 Soldering and Handling Recommendations
    2. 12.2 DNP (S-PDSO-N6) Mechanical Drawings

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

12.1 Soldering and Handling Recommendations

The OPT3001 has been qualified for three soldering reflow operations per JEDEC JSTD-020.

Note that excessive heat may discolor the device and affect optical performance.

See application report SLUA271, QFN/SON PCB Attachment, for details on soldering thermal profile and other information. If the OPT3001 must be removed from a PCB, discard the device and do not reattach.

As with most optical devices, handle the OPT3001 with special care to ensure optical surfaces stay clean and free from damage. See the Do's and Don'ts section for more detailed recommendations. For best optical performance, solder flux and any other possible debris must be cleaned after soldering processes.