SLASE63 November   2014 PCM5252

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison
  6. 6 Pin Configuration and Functions
    1. 6.1 Control Mode Effect On Pin Assignments
    2. 6.2 Pin Assignments
  7. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Electrical Characteristics
    6. 7.6  Switching Characteristics
    7. 7.7  Timing Requirements: SCK Input
    8. 7.8  Timing Requirements: PCM Audio Data
    9. 7.9  Timing Requirements: I2S Master, See
    10. 7.10 Timing Requirements: XSMT
    11. 7.11 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Terminology
      2. 8.3.2 Audio Data Interface
        1. 8.3.2.1 Audio Serial Interface
        2. 8.3.2.2 PCM Audio Data Formats
        3. 8.3.2.3 Zero Data Detect
      3. 8.3.3 XSMT Pin (Soft Mute / Soft Un-Mute)
      4. 8.3.4 Audio Processing
        1. 8.3.4.1  PCM5252 Audio Processing Options
          1. 8.3.4.1.1 Overview
          2. 8.3.4.1.2 miniDSP Instruction Register
          3. 8.3.4.1.3 Digital Output
          4. 8.3.4.1.4 Software
        2. 8.3.4.2  Interpolation Filter
        3. 8.3.4.3  Overview
        4. 8.3.4.4  Smart SOA
        5. 8.3.4.5  Smart BASS
        6. 8.3.4.6  Smart Protection
        7. 8.3.4.7  Implementing a Real World Design
        8. 8.3.4.8  Digital Output
        9. 8.3.4.9  Software
        10. 8.3.4.10 Process Flow
      5. 8.3.5 DAC and Differential Analog Outputs
        1. 8.3.5.1 Analog Outputs
        2. 8.3.5.2 Choosing Between VREF and VCOM Modes
          1. 8.3.5.2.1 Voltage Reference and Output Levels
          2. 8.3.5.2.2 Mode Switching Sequence, from VREF Mode to VCOM Mode
        3. 8.3.5.3 Digital Volume Control
          1. 8.3.5.3.1 Emergency Ramp-Down
        4. 8.3.5.4 Analog Gain Control
      6. 8.3.6 Reset and System Clock Functions
        1. 8.3.6.1 Clocking Overview
        2. 8.3.6.2 Clock Slave Mode With Master and System Clock (SCK) Input (4 Wire I2S)
        3. 8.3.6.3 Clock Slave Mode With BCK PLL to Generate Internal Clocks (3-Wire PCM)
        4. 8.3.6.4 Clock Generation Using the PLL
        5. 8.3.6.5 PLL Calculation
          1. 8.3.6.5.1 Examples:
            1. 8.3.6.5.1.1 Recommended PLL Settings
        6. 8.3.6.6 Clock Master Mode from Audio Rate Master Clock
        7. 8.3.6.7 Clock Master from a Non-Audio Rate Master Clock
    4. 8.4 Device Functional Modes
      1. 8.4.1 Choosing a Control Mode
        1. 8.4.1.1 Software Control
          1. 8.4.1.1.1 SPI Interface
            1. 8.4.1.1.1.1 Register Read and Write Operation
          2. 8.4.1.1.2 I2C Interface
            1. 8.4.1.1.2.1 Slave Address
            2. 8.4.1.1.2.2 Register Address Auto-Increment Mode
            3. 8.4.1.1.2.3 Packet Protocol
            4. 8.4.1.1.2.4 Write Register
            5. 8.4.1.1.2.5 Read Register
            6. 8.4.1.1.2.6 Timing Characteristics
      2. 8.4.2 VREF and VCOM Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 High Fidelity Smartphone Application
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
          1. 9.2.1.2.1 Initialization Script
        3. 9.2.1.3 Application Performance Plot
  10. 10Power Supply Recommendations
    1. 10.1 Power Supply Distribution and Requirements
    2. 10.2 Recommended Powerdown Sequence
      1. 10.2.1 XSMT = 0
      2. 10.2.2 Clock Error Detect
      3. 10.2.3 Planned Shutdown
      4. 10.2.4 Unplanned Shutdown
    3. 10.3 External Power Sense Undervoltage Protection Mode
    4. 10.4 Power-On Reset Function
      1. 10.4.1 Power-On Reset, DVDD 3.3-V Supply
      2. 10.4.2 Power-On Reset, DVDD 1.8-V Supply
    5. 10.5 PCM5252 Power Modes
      1. 10.5.1 Setting Digital Power Supplies and I/O Voltage Rails
        1. 13.2.2 PLL Tables for Software Controlled Devices
      2. 10.5.2 Power Save Modes
        1. 13.2.1.3 Page 1 Registers
          1. 13.2.1.3.1 Page 1 / Register 1
          2. 13.2.1.3.2 Page 1 / Register 2
          3. 13.2.1.3.3 Page 1 / Register 5
          4. 13.2.1.3.4 Page 1 / Register 6
          5. 13.2.1.3.5 Page 1 / Register 7
          6. 13.2.1.3.6 Page 1 / Register 8
          7. 13.2.1.3.7 Page 1 / Register 9
        2. 13.2.1.4 Page 44 Registers
          1. 13.2.1.4.1 Page 44 / Register 1
        3. 13.2.1.5 Page 253 Registers
          1. 13.2.1.5.1 Page 253 / Register 63
          2. 13.2.1.5.2 Page 253 / Register 64
      3. 10.5.3 Power Save Parameter Programming
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 13.2.1.2.19 Page 0 / Register 24
      2. 13.2.1.2.20 Page 0 / Register 27
      3. 13.2.1.2.21 Page 0 / Register 28
      4. 13.2.1.2.22 Page 0 / Register 29
      5. 13.2.1.2.23 Page 0 / Register 30
      6. 13.2.1.2.24 Page 0 / Register 32
      7. 13.2.1.2.25 Page 0 / Register 33
      8. 13.2.1.2.26 Page 0 / Register 34
      9. 13.2.1.2.27 Page 0 / Register 35
      10. 13.2.1.2.28 Page 0 / Register 36
      11. 13.2.1.2.29 Page 0 / Register 37
      12. 13.2.1.2.30 Page 0 / Register 40
      13. 13.2.1.2.31 Page 0 / Register 41
      14. 13.2.1.2.32 Page 0 / Register 42
      15. 13.2.1.2.33 Page 0 / Register 43
      16. 13.2.1.2.34 Page 0 / Register 44
      17. 13.2.1.2.35 Page 0 / Register 59
      18. 13.2.1.2.36 Page 0 / Register 60
      19. 13.2.1.2.37 Page 0 / Register 61
      20. 13.2.1.2.38 Page 0 / Register 62
      21. 13.2.1.2.39 Page 0 / Register 63
      22. 13.2.1.2.40 Page 0 / Register 64
      23. 13.2.1.2.41 Page 0 / Register 65
      24. 13.2.1.2.42 Page 0 / Register 80
      25. 13.2.1.2.43 Page 0 / Register 81
      26. 13.2.1.2.44 Page 0 / Register 82
      27. 13.2.1.2.45 Page 0 / Register 83
      28. 13.2.1.2.46 Page 0 / Register 84
      29. 13.2.1.2.47 Page 0 / Register 85
      30. 13.2.1.2.48 Page 0 / Register 86
      31. 13.2.1.2.49 Page 0 / Register 87
      32. 13.2.1.2.50 Page 0 / Register 90
      33. 13.2.1.2.51 Page 0 / Register 91
      34. 13.2.1.2.52 Page 0 / Register 92
      35. 13.2.1.2.53 Page 0 / Register 93
      36. 13.2.1.2.54 Page 0 / Register 94
      37. 13.2.1.2.55 Page 0 / Register 95
      38. 13.2.1.2.56 Page 0 / Register 108
      39. 13.2.1.2.57 Page 0 / Register 109
      40. 13.2.1.2.58 Page 0 / Register 114
      41. 13.2.1.2.59 Page 0 / Register 115
      42. 13.2.1.2.60 Page 0 / Register 118
      43. 13.2.1.2.61 Page 0 / Register 119
      44. 13.2.1.2.62 Page 0 / Register 120
      45. 13.2.1.2.63 Page 0 / Register 121
      46. 13.2.1.2.64 Page 0 / Register 122
      47. 13.2.1.2.65 Page 0 / Register 123
      48. 13.2.1.2.66 Page 0 / Register 124
      49. 13.2.1.2.67 Page 0 / Register 125
    2. 11.2 Layout Example
  12. 12Programming
    1. 12.1 Coefficient Data Formats
    2. 12.2 Power Down and Reset Behavior
  13. 13Register Maps
    1. 13.1 PCM5252 Register Map
      1. 13.1.1 Detailed Register Descriptions
        1. 13.1.1.1 Register Map Summary
        2. 13.1.1.2 Page 0 Registers
        3. 13.1.1.3 Page 1 Registers
        4. 13.1.1.4 Page 44 Registers
        5. 13.1.1.5 Page 253 Registers
      2. 13.1.2 PLL Tables for Software Controlled Devices
  14. 14Device and Documentation Support
    1. 14.1 Community Resources
    2. 14.2 Trademarks
    3. 14.3 Electrostatic Discharge Caution
  15. 15Mechanical, Packaging, and Orderable Information
  16. 14Device and Documentation Support
    1. 14.1 Community Resources
    2. 14.2 Trademarks
    3. 14.3 Electrostatic Discharge Caution
  17. 15Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

11 Layout

11.1 Layout Guidelines

  • The PCM5252 family of devices are simple to layout. Most engineers use a shared common ground for an entire device. GND can consider AGND and DGND connected.
  • Good system partitioning should keep digital clock and interface traces away from the differential analog outputs for highest analog performance. This reduces any high-speed clock return currents influencing the analog outputs.
  • Power supply and charge pump decoupling capacitors should be placed as close as possible to the device.
  • The thermal pad on the underside of the package should be connected to GND.
  • The top layer should be used for routing signals, whilst the bottom layer can be used for GND.

11.2 Layout Example

PCM5252 layout_slase12.gif Figure 83. PCM5252 Layout Example