SLASE63 November   2014 PCM5252

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Device Comparison
  6. Pin Configuration and Functions
    1. 6.1 Control Mode Effect On Pin Assignments
    2. 6.2 Pin Assignments
  7. Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Electrical Characteristics
    6. 7.6  Switching Characteristics
    7. 7.7  Timing Requirements: SCK Input
    8. 7.8  Timing Requirements: PCM Audio Data
    9. 7.9  Timing Requirements: I2S Master, See
    10. 7.10 Timing Requirements: XSMT
    11. 7.11 Typical Characteristics
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Terminology
      2. 8.3.2 Audio Data Interface
        1. 8.3.2.1 Audio Serial Interface
        2. 8.3.2.2 PCM Audio Data Formats
        3. 8.3.2.3 Zero Data Detect
      3. 8.3.3 XSMT Pin (Soft Mute / Soft Un-Mute)
      4. 8.3.4 Audio Processing
        1. 8.3.4.1  PCM5252 Audio Processing Options
          1. 8.3.4.1.1 Overview
          2. 8.3.4.1.2 miniDSP Instruction Register
          3. 8.3.4.1.3 Digital Output
          4. 8.3.4.1.4 Software
        2. 8.3.4.2  Interpolation Filter
        3. 8.3.4.3  Overview
        4. 8.3.4.4  Smart SOA
        5. 8.3.4.5  Smart BASS
        6. 8.3.4.6  Smart Protection
        7. 8.3.4.7  Implementing a Real World Design
        8. 8.3.4.8  Digital Output
        9. 8.3.4.9  Software
        10. 8.3.4.10 Process Flow
      5. 8.3.5 DAC and Differential Analog Outputs
        1. 8.3.5.1 Analog Outputs
        2. 8.3.5.2 Choosing Between VREF and VCOM Modes
          1. 8.3.5.2.1 Voltage Reference and Output Levels
          2. 8.3.5.2.2 Mode Switching Sequence, from VREF Mode to VCOM Mode
        3. 8.3.5.3 Digital Volume Control
          1. 8.3.5.3.1 Emergency Ramp-Down
        4. 8.3.5.4 Analog Gain Control
      6. 8.3.6 Reset and System Clock Functions
        1. 8.3.6.1 Clocking Overview
        2. 8.3.6.2 Clock Slave Mode With Master and System Clock (SCK) Input (4 Wire I2S)
        3. 8.3.6.3 Clock Slave Mode With BCK PLL to Generate Internal Clocks (3-Wire PCM)
        4. 8.3.6.4 Clock Generation Using the PLL
        5. 8.3.6.5 PLL Calculation
          1. 8.3.6.5.1 Examples:
            1. 8.3.6.5.1.1 Recommended PLL Settings
        6. 8.3.6.6 Clock Master Mode from Audio Rate Master Clock
        7. 8.3.6.7 Clock Master from a Non-Audio Rate Master Clock
    4. 8.4 Device Functional Modes
      1. 8.4.1 Choosing a Control Mode
        1. 8.4.1.1 Software Control
          1. 8.4.1.1.1 SPI Interface
            1. 8.4.1.1.1.1 Register Read and Write Operation
          2. 8.4.1.1.2 I2C Interface
            1. 8.4.1.1.2.1 Slave Address
            2. 8.4.1.1.2.2 Register Address Auto-Increment Mode
            3. 8.4.1.1.2.3 Packet Protocol
            4. 8.4.1.1.2.4 Write Register
            5. 8.4.1.1.2.5 Read Register
            6. 8.4.1.1.2.6 Timing Characteristics
      2. 8.4.2 VREF and VCOM Modes
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 High Fidelity Smartphone Application
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
          1. 9.2.1.2.1 Initialization Script
        3. 9.2.1.3 Application Performance Plot
  10. 10Power Supply Recommendations
    1. 10.1 Power Supply Distribution and Requirements
    2. 10.2 Recommended Powerdown Sequence
      1. 10.2.1 XSMT = 0
      2. 10.2.2 Clock Error Detect
      3. 10.2.3 Planned Shutdown
      4. 10.2.4 Unplanned Shutdown
    3. 10.3 External Power Sense Undervoltage Protection Mode
    4. 10.4 Power-On Reset Function
      1. 10.4.1 Power-On Reset, DVDD 3.3-V Supply
      2. 10.4.2 Power-On Reset, DVDD 1.8-V Supply
    5. 10.5 PCM5252 Power Modes
      1. 10.5.1 Setting Digital Power Supplies and I/O Voltage Rails
        1. 13.2.2 PLL Tables for Software Controlled Devices
      2. 10.5.2 Power Save Modes
        1. 13.2.1.3 Page 1 Registers
          1. 13.2.1.3.1 Page 1 / Register 1
          2. 13.2.1.3.2 Page 1 / Register 2
          3. 13.2.1.3.3 Page 1 / Register 5
          4. 13.2.1.3.4 Page 1 / Register 6
          5. 13.2.1.3.5 Page 1 / Register 7
          6. 13.2.1.3.6 Page 1 / Register 8
          7. 13.2.1.3.7 Page 1 / Register 9
        2. 13.2.1.4 Page 44 Registers
          1. 13.2.1.4.1 Page 44 / Register 1
        3. 13.2.1.5 Page 253 Registers
          1. 13.2.1.5.1 Page 253 / Register 63
          2. 13.2.1.5.2 Page 253 / Register 64
      3. 10.5.3 Power Save Parameter Programming
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 13.2.1.2.19 Page 0 / Register 24
      2. 13.2.1.2.20 Page 0 / Register 27
      3. 13.2.1.2.21 Page 0 / Register 28
      4. 13.2.1.2.22 Page 0 / Register 29
      5. 13.2.1.2.23 Page 0 / Register 30
      6. 13.2.1.2.24 Page 0 / Register 32
      7. 13.2.1.2.25 Page 0 / Register 33
      8. 13.2.1.2.26 Page 0 / Register 34
      9. 13.2.1.2.27 Page 0 / Register 35
      10. 13.2.1.2.28 Page 0 / Register 36
      11. 13.2.1.2.29 Page 0 / Register 37
      12. 13.2.1.2.30 Page 0 / Register 40
      13. 13.2.1.2.31 Page 0 / Register 41
      14. 13.2.1.2.32 Page 0 / Register 42
      15. 13.2.1.2.33 Page 0 / Register 43
      16. 13.2.1.2.34 Page 0 / Register 44
      17. 13.2.1.2.35 Page 0 / Register 59
      18. 13.2.1.2.36 Page 0 / Register 60
      19. 13.2.1.2.37 Page 0 / Register 61
      20. 13.2.1.2.38 Page 0 / Register 62
      21. 13.2.1.2.39 Page 0 / Register 63
      22. 13.2.1.2.40 Page 0 / Register 64
      23. 13.2.1.2.41 Page 0 / Register 65
      24. 13.2.1.2.42 Page 0 / Register 80
      25. 13.2.1.2.43 Page 0 / Register 81
      26. 13.2.1.2.44 Page 0 / Register 82
      27. 13.2.1.2.45 Page 0 / Register 83
      28. 13.2.1.2.46 Page 0 / Register 84
      29. 13.2.1.2.47 Page 0 / Register 85
      30. 13.2.1.2.48 Page 0 / Register 86
      31. 13.2.1.2.49 Page 0 / Register 87
      32. 13.2.1.2.50 Page 0 / Register 90
      33. 13.2.1.2.51 Page 0 / Register 91
      34. 13.2.1.2.52 Page 0 / Register 92
      35. 13.2.1.2.53 Page 0 / Register 93
      36. 13.2.1.2.54 Page 0 / Register 94
      37. 13.2.1.2.55 Page 0 / Register 95
      38. 13.2.1.2.56 Page 0 / Register 108
      39. 13.2.1.2.57 Page 0 / Register 109
      40. 13.2.1.2.58 Page 0 / Register 114
      41. 13.2.1.2.59 Page 0 / Register 115
      42. 13.2.1.2.60 Page 0 / Register 118
      43. 13.2.1.2.61 Page 0 / Register 119
      44. 13.2.1.2.62 Page 0 / Register 120
      45. 13.2.1.2.63 Page 0 / Register 121
      46. 13.2.1.2.64 Page 0 / Register 122
      47. 13.2.1.2.65 Page 0 / Register 123
      48. 13.2.1.2.66 Page 0 / Register 124
      49. 13.2.1.2.67 Page 0 / Register 125
    2. 11.2 Layout Example
  12. 12Programming
    1. 12.1 Coefficient Data Formats
    2. 12.2 Power Down and Reset Behavior
  13. 13Register Maps
    1. 13.1 PCM5252 Register Map
      1. 13.1.1 Detailed Register Descriptions
        1. 13.1.1.1 Register Map Summary
        2. 13.1.1.2 Page 0 Registers
        3. 13.1.1.3 Page 1 Registers
        4. 13.1.1.4 Page 44 Registers
        5. 13.1.1.5 Page 253 Registers
      2. 13.1.2 PLL Tables for Software Controlled Devices
  14. 14Device and Documentation Support
    1. 14.1 Community Resources
    2. 14.2 Trademarks
    3. 14.3 Electrostatic Discharge Caution
  15. 15Mechanical, Packaging, and Orderable Information
  16. 14Device and Documentation Support
    1. 14.1 Community Resources
    2. 14.2 Trademarks
    3. 14.3 Electrostatic Discharge Caution
  17. 15Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ(パッケージ|ピン)
サーマルパッド・メカニカル・データ
発注情報

Specifications

Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
Supply voltage AVDD, CPVDD, DVDD –0.3 3.9 V
LDO with DVDD at 1.8 V –0.3 2.25
Digital input voltage DVDD at 1.8 V –0.3 2.25 V
DVDD at 3.3 V –0.3 3.9
Analog input voltage –0.3 3.9 V
Storage temperature, Tstg –40 125 °C

ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2500 V
Charged-device model (CDM), per JEDEC specification JESD22-C101(2) ±1500
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

Recommended Operating Conditions

MIN NOM MAX UNIT
AVDD Analog power supply voltage Referenced to AGND(1) VCOM mode 3 3.3 3.46 V
VREF mode 3.2 3.3 3.46
DVDD Digital power supply voltage Referenced to DGND(1) 1.8 V DVDD 1.65 1.8 1.95 V
3.3 V DVDD 3.1 3.3 3.46
CPVDD Charge pump supply voltage Referenced to CPGND(1) 3.1 3.3 3.46 V
MCLK Master clock frequency 50 MHz
LOL, LOR Stereo line output load resistance 2 10
CLOUT Digital output load capacitance 10 pF
TJ Operating junction temperature –25 85 °C
All grounds on board are tied together; they must not differ in voltage by more than 0.2-V maximum, for any combination of ground signals.

Thermal Information

THERMAL METRIC(1) PW UNIT
20 PINS
RθJA Junction-to-ambient thermal resistance 91.2 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 25.3 °C/W
RθJB Junction-to-board thermal resistance 42 °C/W
ψJT Junction-to-top characterization parameter 1 °C/W
ψJB Junction-to-board characterization parameter 41.5 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance °C/W
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.

Electrical Characteristics

All specifications at TA = 25°C, AVDD = CPVDD = DVDD = 3.3V, fS = 48kHz, system clock = 512 fS and 24-bit data unless otherwise noted.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
Resolution 16 24 32 Bits
Digital Input/Output
Logic family: 3.3 V LVCMOS compatible
VIH Input logic level, high 0.7×DVDD V
VIL Input logic level, low 0.3×DVDD V
IIH Input logic current, high VIN = VDD 10 µA
IIL Input logic current, low VIN = 0 V –10 µA
VOH Output logic level, high IOH = –4 mA 0.8×DVDD V
VOL Output logic level, low IOL = 4 mA 0.22×DVDD V
Logic family 1.8 V LVCMOS compatible
VIH Input logic level, high 0.7×DVDD V
VIL Input logic level, low 0.3×DVDD V
IIH Input logic current, high VIN = VDD 10 µA
IIL Input logic current, low VIN = 0 V –10 µA
VOH Output logic level, high IOH = –2 mA 0.8×DVDD V
VOL Output logic level, low IOL = 2 mA 0.22×DVDD V
Dynamic Performance (PCM Mode)(1)(2)
THD+N at –1 dBFS(2) fS = 48 kHz –93 –83 dB
fS = 96 kHz –93
fS = 192 kHz –93
Dynamic range(2) EIAJ, A-weighted, fS = 48 kHz 108 114 dB
EIAJ, A-weighted, fS = 96 kHz 114
EIAJ, A-weighted, fS = 192 kHz 114
Signal-to-noise ratio(2) EIAJ, A-weighted, fS = 48 kHz 114 dB
EIAJ, A-weighted, fS = 96 kHz 114
EIAJ, A-weighted, fS = 192 kHz 114
Signal to noise ratio with analog mute(2)(3) EIAJ, A-weighted, fS = 48 kHz 113 123 dB
EIAJ, A-weighted, fS = 96 kHz 113 123
EIAJ, A-weighted, fS = 192 kHz 113 123
Channel separation fS = 48 kHz 100 / 95 109 / 103 dB
fS = 96 kHz 100 / 95 109 / 103
fS = 192 kHz 100 / 95 109 / 103
Analog Output
Single Ended Output voltage 2.1 VRMS
Differential Output Voltage 4.2 VRMS
Gain error –6 ±2 6 % of FSR
Gain mismatch, channel-to-channel –6 ±2 6 % of FSR
Bipolar zero error (per pin) At bipolar zero –2 ±1 2 mV
Load impedance 5
Filter Characteristics–1: Normal (8x)
Pass band 0.45fS
Stop band 0.55fS
Stop band attenuation –60 dB
Pass-band ripple ±0.02 dB
Delay time 20fS s
Filter Characteristics–2: Low Latency (8x)
Pass band 0.47fS
Stop band 0.55fS
Stop band attenuation –52 dB
Pass-band ripple ±0.0001 dB
Delay time 3.5fS s
Filter Characteristics–3: Asymmetric FIR (8x)
Pass band 0.40fS
Stop band 0.72fS
Stop band attenuation –52 dB
Pass-band ripple ±0.05 dB
Delay time 1.2fS s
Filter Characteristics–4: High-Attenuation (8x)
Pass band 0.45fS
Stop band 0.45S
Stop band attenuation –100 dB
Pass-band ripple ±0.0005 dB
Delay time 33.7fS s
Power Supply Requirements
DVDD Digital supply voltage Target DVDD = 1.8 V 1.65 1.8 1.95 VDC
DVDD Digital supply voltage Target DVDD = 3.3 V 3 3.3 3.6 VDC
AVDD Analog supply voltage 3 3.3 3.6 VDC
CPVDD Charge-pump supply voltage 3 3.3 3.6 VDC
IDD DVDD supply current at 1.8 V fS = 48 kHz, Input is Bipolar Zero data 11 14 mA
fS = 96 kHz, Input is Bipolar Zero data 12
fS = 192 kHz, Input is Bipolar Zero data 14
IDD DVDD supply current at 1.8 V fS = 48 kHz, Input is 1kHz -1dBFS data 11 14 mA
fS = 96 kHz, Input is 1kHz -1dBFS data 12
fS = 192 kHz, Input is 1kHz -1dBFS data 14
IDD DVDD supply current at 1.8 V(4) fS = N/A, Power Down Mode 0.3 0.6 mA
IDD DVDD supply current at 3.3 V fS = 48 kHz, Input is Bipolar Zero data 12 15 mA
fS = 96 kHz, Input is Bipolar Zero data 13
fS = 192 kHz, Input is Bipolar Zero data 15
IDD DVDD supply current at 3.3 V fS = 48 kHz, Input is 1kHz -1dBFS data 12 15 mA
fS = 96 kHz, Input is 1kHz -1dBFS data 13
fS = 192 kHz, Input is 1kHz -1dBFS data 15
IDD DVDD supply current at 3.3 V(4) fS = N/A, Power Down Mode 0.5 0.8 mA
ICC AVDD / CPVDD supply current fS = 48 kHz, Input is Bipolar Zero data 11 16 mA
fS = 96 kHz, Input is Bipolar Zero data 11
fS = 192 kHz, Input is Bipolar Zero data 11
ICC AVDD / CPVDD supply current fS = 48 kHz, Input is 1kHz -1dBFS data 24 32 mA
fS = 96 kHz, Input is 1kHz -1dBFS data 24
fS = 192 kHz, Input is 1kHz -1dBFS data 24
ICC AVDD / CPVDD supply current(4) fS = N/A, Power Down Mode 0.2 0.4 mA
Power dissipation, DVDD = 1.8 V fS = 48 kHz, Input is Bipolar Zero data 59.4 78 mW
fS = 96 kHz, Input is Bipolar Zero data 61.2
fS = 192 kHz, Input is Bipolar Zero data 64.8
Power dissipation, DVDD = 1.8 V fS = 48 kHz, Input is 1kHz -1dBFS data 99 130.8 mW
fS = 96 kHz, Input is 1kHz -1dBFS data 100.8
fS = 192 kHz, Input is 1kHz -1dBFS data 104.4
Power dissipation, DVDD = 1.8 V(4) fS = N/A (Power Down Mode) 1.2 mW
Power dissipation, DVDD = 3.3 V fS = 48 kHz, Input is Bipolar Zero data 79.2 103 mW
fS = 96 kHz, Input is Bipolar Zero data 82.5
fS = 192 kHz, Input is Bipolar Zero data 89.1
Power dissipation, DVDD = 3.3 V fS = 48 kHz, Input is 1kHz -1dBFS data 118.8 155 mW
fS = 96 kHz, Input is 1kHz -1dBFS data 122.1
fS = 192 kHz, Input is 1kHz -1dBFS data 128.7
Power dissipation, DVDD = 3.3 V(4) fS = N/A (Power Down Mode) 2.3 4 mW
Filter condition: THD+N: 20-Hz HPF, 20-kHz AES17 LPF; Dynamic range: 20-Hz HPF, 20-kHz AES17 LPF; A-weighted signal-to-noise ratio: 20-Hz HPF, 20-kHz AES17 LPF; A-weighted channel separation: 20-Hz HPF, 20-kHz AES17 LPF. Analog performance specifications are measured using the System Two Cascade™ audio measurement system by Audio Precision™ in the RMS mode.
Output load is 10 kΩ, with 470-Ω output resistor and a 2.2-nF shunt capacitor (see recommended output filter).
Assert XSMT or both L-ch and R-ch PCM data are Bipolar Zero.
Power Down Mode, with LRCK, BCK, and SCK halted at Low level.

Switching Characteristics

over operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
DATA FORMAT (PCM MODE)
Audio data interface format I2S, left-justified, right-justified, and TDM
Audio data bit length 16, 20, 24, 32-bit acceptable
Audio data format MSB first, twos-complement
fS Sampling frequency(1) 8 384 kHz
CLOCKS
System clock frequency 64, 128, 192, 256, 384, 512, 768, 1024, 1152, 1536, 2048, or 3072
fSCK, up to 50 Mhz
PLL input frequency (2) Clock divider uses fractional divide
D > 0, P=1
6.7 20 MHz
Clock divider uses integer divide
D = 0, P=1
1 20 MHz
One sample time is defined as the reciprocal of the sampling frequency. 1 × tS = 1 / fS
With the appropriate P coefficient setting, the PLL accepts up to 50 MHz. This clock is then divided to meet the ≤ 20-MHz requirement. See PLL Calculation.

Timing Requirements: SCK Input

Figure 4 shows the timing requirements for the system clock input. For optimal performance, use a clock source with low phase jitter and noise.
MIN NOM MAX UNIT
tSCY System clock pulse cycle time 20 1000 ns
tSCKH System clock pulse width, high DVDD = 1.8 V 8 ns
DVDD = 3.3 V 9
tSCKL System clock pulse width, low DVDD = 1.8 V 8 ns
DVDD = 3.3 V 9
PCM5252 f_pcm51xx_td_sck_req.gif Figure 4. Timing Requirements for SCK Input

Timing Requirements: PCM Audio Data

MIN NOM MAX UNIT
tBCY BCK Pulse Cycle Time 40 ns
tBCL BCK Pulse Width LOW 16 ns
tBCH BCK Pulse Width HIGH 16 ns
tBL BCK Rising Edge to LRCK Edge 8 ns
tBCK BCK frequency at DVDD = 3.3V 24.576 MHz
tBCK(1.8V) BCK frequency at DVDD = 1.8V 12.288 MHz
tLB LRCK Edge to BCK Rising Edge 8 ns
tDS DATA Set Up Time 8 ns
tDH DATA Hold Time 8 ns
tDOD DATA delay time from BCK falling edge 15 ns
PCM5252 f_pcm512x4x_td_pcm_aud_slv.gif Figure 5. PCM5252 Serial Audio Timing - Slave

In software mode, The PCM5252 can act as an I2S master, generating BCK and LRCK as outputs from the SCK input.

Table 3. I2S Master Mode Registers

Register Function
Page0, Register 9, D(0), D(4), and D(5) I2S Master mode select
Register 32, D(6:0)
Register 33, D(7:0) BCK divider and LRCK divider

Timing Requirements: I2S Master, See Figure 6

MIN NOM MAX UNIT
tBCY BCK Pulse Cycle Time 40 ns
tBCL BCK Pulse Width LOW 16 ns
tBCH BCK Pulse Width HIGH 16 ns
tBCK BCK frequency at DVDD = 3.3 V 24.576 MHz
tBCK(1.8V) BCK frequency at DVDD = 1.8 V 12.288 MHz
tLRD LRCKx delay time from BCKx falling edge –10 20 ns
tDS DATA Set Up Time 8 ns
tDH DATA Hold Time 8 ns
tDOD DATA delay time from BCK falling edge at DVDD = 3.3 V 15 ns
tDOD(1.8V) DATA delay time from BCK falling edge at DVDD = 1.8 V 20 ns
PCM5252 f_pcm512x4x_td_pcm_aud_mstr.gif Figure 6. PCM5252 Serial Audio Timing - I2S Master

Timing Requirements: XSMT

MIN NOM MAX UNIT
tr Rise time 20 ns
tf Fall time 20 ns
PCM5252 f_pcm51xx_td_xsmt_soft_mute.gif Figure 7. XSMT Timing for Soft Mute and Soft Un-Mute

Typical Characteristics

All specifications at TA = 25°C, AVDD = CPVDD = DVDD = 3.3V, fS = 48kHz, system clock = 512 fS and 24-bit data unless otherwise noted.
PCM5252 thd_n_input_level_5101.gif
Figure 8. THD+N vs Input Level
PCM5252 fft_-60dB_5101.gif
Figure 10. FFT Plot At –60 db Input
PCM5252 fft_bpz_5101.gif
Figure 12. FFT Plot at Bipolar Zero Data (BPZ)
PCM5252 fft_bpz_amute_5101.gif
Figure 14. FFT Plot at BPZ With Analog Mute (AMUTE)
PCM5252 fft_-60_sub_300kHz_5101.gif
Figure 16. FFT Plot at –60 dB to 300 khz
PCM5252 thd_n_input_level_5102.gif
Figure 9. THD+N vs Input Level
PCM5252 fft_-60dB_5102.gif
Figure 11. FFT Plot At –60 db Input
PCM5252 fft_bpz_5102.gif
Figure 13. FFT Plot at BPZ
PCM5252 fft_bpz_amute_5102.gif
Figure 15. FFT Plot at BPZ With Analog Mute (AMUTE)
PCM5252 fft_-60_sub_300kHz_5102.gif
Figure 17. FFT Plot at –60 dB to 300 khz