The SM470R1B1M(1)
High-end embedded control applications demand more performance from their controllers while maintaining low costs. The B1M RISC core architecture offers solutions to these performance and cost demands while maintaining low power consumption.
The B1M devices contain the following:
The functions performed by the 470+ system module (SYS) include:
The enhanced RTI module on the B1M has the option to be driven by the oscillator clock. The DWD is a 25-bit resettable decrementing counter that provides a system reset when the watchdog counter expires. This data sheet includes device-specific information such as memory and peripheral select assignment, interrupt priority, and a device memory map. For a more detailed functional description of the SYS module, see the TMS470R1x System Module Reference Guide (SPNU189).
The B1M memory includes general-purpose SRAM supporting single-cycle read/write accesses in byte, half-word, and word modes.
The flash memory on this device is a nonvolatile, electrically erasable, and programmable memory implemented with a 32-bit-wide data bus interface. The flash operates with a system clock frequency of up to 24 MHz or 30 MHz, depending on the input voltage. When in pipeline mode, the flash operates with a system clock frequency of up to 48 MHz or 60 MHz, depending on the input voltage. For more detailed information on the flash, see Section 8.2.1.4.
The MSM and the JTAG security module prevent unauthorized access and visibility to on-chip memory, thereby preventing reverse engineering or manipulation of proprietary code.
The B1M device has twelve communication interfaces: two SPIs, three SCIs, two HECCs, and five I2Cs. The SPI provides a convenient method of serial interaction for high-speed communications between similar shift-register type devices. The SCI is a full-duplex, serial I/O interface intended for asynchronous communication between the CPU and other peripherals using the standard non-return-to-zero (NRZ) format. The HECC uses a serial, multimaster communication protocol that efficiently supports distributed realtime control with robust communication rates of up to 1 Mbps. These CAN peripherals are ideal for applications operating in noisy and harsh environments (for example, industrial fields) that require reliable serial communication or multiplexed wiring. The I2C module is a multimaster communication module providing an interface between the B1M microcontroller and an I2C-compatible device through the I2C serial bus. The I2C supports both 100 Kbps and 400 Kbps speeds. For more detailed functional information on the SPI, SCI, and CAN peripherals, see the specific reference guides (SPNU195, SPNU196, and SPNU197). For more detailed functional information on the I2C, see the TMS470R1x Inter-Integrated Circuit (I2C) Reference Guide (SPNU223).
The HET is an advanced intelligent timer that provides sophisticated timing functions for realtime applications. The timer is software-controlled, using a reduced instruction set, with a specialized timer micromachine and an attached I/O port. The HET can be used for compare, capture, or general-purpose I/O. It is especially well-suited for applications requiring multiple sensor information and drive actuators with complex and accurate time pulses. The HET used in this device is the high-end timer lite. It has fewer I/Os than the usual 32 in a standard HET. For more detailed functional information on the HET, see the TMS470R1x High-End Timer (HET) Reference Guide (SPNU199).
The B1M HET peripheral contains the XOR-share feature. This feature allows two adjacent HET high-resolution channels to be XORed together, making it possible to output smaller pulses than a standard HET. For more detailed information on the HET XOR-share feature, see the TMS470R1x High-End Timer (HET) Reference Guide (SPNU199).
The B1M device has one 10-bit-resolution, sample-and-hold MibADC. Each of the MibADC channels can be converted individually or can be grouped by software for sequential conversion sequences. There are three separate groupings, two of which can be triggered by an external event. Each sequence can be converted once when triggered or configured for continuous conversion mode. For more detailed functional information on the MibADC, see the TMS470R1x Multi-Buffered Analog-to-Digital Converter (MibADC) Reference Guide (SPNU206).
The ZPLL clock module contains a phase-locked loop, a clock-monitor circuit, a clock-enable circuit, and a prescaler (with prescale values of 1 to 8). The function of the ZPLL is to multiply the external frequency reference to a higher frequency for internal use. The ZPLL provides ACLK to the system (SYS) module. The SYS module subsequently provides system clock (SYSCLK), realtime interrupt clock (RTICLK), CPU clock (MCLK), and peripheral interface clock (ICLK) to all other B1M device modules. For more detailed functional information on the ZPLL, see the TMS470R1x Zero-Pin Phase-Locked Loop (ZPLL) Clock Module Reference Guide (SPNU212).
NOTE
ACLK should not be confused with the MibADC internal clock, ADCLK. ACLK is the continuous system clock from an external resonator/crystal reference.
The EBM is a standalone module that supports the multiplexing of the GIO functions and the expansion bus interface. For more information on the EBM, see the TMS470R1x Expansion Bus Module (EBM) Reference Guide (SPNU222).
The B1M device also has an external clock prescaler (ECP) module that when enabled, outputs a continuous external clock (ECLK) on a specified GIO pin. The ECLK frequency is a user-programmable ratio of the peripheral interface clock (ICLK) frequency. For more detailed functional information on the ECP, see the TMS470R1x External Clock Prescaler (ECP) Reference Guide (SPNU202).
PART NUMBER | PACKAGE | TA |
---|---|---|
SM470R1B1M-HT | KGD (0) | –55°C to 220°C |
CFP (TBAR) (84) | ||
CFP (84) | ||
LQFP (144) | –55°C to 150°C |
Changes from H Revision (September 2013) to I Revision
Changes from G Revision (July 2013) to H Revision
CHARACTERISTICS(1) | DEVICE DESCRIPTION SM470R1B1M | COMMENTS |
---|---|---|
MEMORY | ||
For the number of memory selects on this device, see Table 8-5, SM470R1B1M Memory Selection Assignment. | ||
INTERNAL MEMORY | Pipeline/non-pipeline 1MB flash 64KB SRAM MSM JTAG security module |
Flash is pipeline-capable. The B1M RAM is implemented in one 64K array selected by two memory-select signals (see Table 8-5, SM470R1B1M Memory Selection Assignment ). |
PERIPHERALS | ||
For the device-specific interrupt priority configurations, see Table 8-2, Interrupt Priority. And for the 1K peripheral address ranges and their peripheral selects, see Table 8-7, B1M Peripherals, System Module, and Flash Base Addresses. | ||
CLOCK | ZPLL | Zero-pin PLL has no external loop filter pins. |
Expansion bus | EBM | Expansion bus module with 42 pins. Supports 8- and 16-bit memories. See Table 8-3 for details. |
GENERAL-PURPOSE I/Os | 46 I/O | Port A has 8 external pins. Port B has only 1 external pin. Port C has 5 external pins. Port D has 6 external pins. Ports E, F, and G each have 8 external pins. Port H has 2 external pins. |
ECP | Yes | |
SCI | 3 (3 pin) | |
CAN (HECC and/or SCC) | 2 HECC | Two HECC |
SPI (5-pin, 4-pin, or 3-pin) | 2 (5 pin) | |
I2C | 5 | |
HET with XOR share | 12 I/O | The high-resolution (HR) SHARE feature allows even-numbered HR pins to share the next higher odd-numbered HR pin structures. This HR sharing is independent of whether or not the odd pin is available externally. If an odd pin is available externally and shared, then the odd pin can only be used as a general-purpose I/O. For more information on HR SHARE, see the TMS470R1x High-End Timer (HET) Reference Guide (SPNU199). |
HET RAM | 64-instruction capacity | |
MibADC | 10-bit, 12-channel 64-word FIFO |
Both the logic and registers for a full 16-channel MibADC are present. |
CORE VOLTAGE | 1.8 V | |
I/O VOLTAGE | 3.3 V | |
PINS | 84 or 144 | |
PACKAGES | HFQ, HKP, or PGE |