SPNS155I September   2009  – June 2015 SM470R1B1M-HT

PRODUCTION DATA.  

  1. 1 Device Overview
    1. 1.1 Features
    2. 1.2 Applications
    3. 1.3 Description
    4. 1.4 Functional Block Diagram
  2. 2 Revision History
  3. 3 Device Characteristics
  4. 4 Bare Die
    1. 4.1 Bare Die Information
  5. 5 Pin Configuration and Functions
    1. 5.1 Features
    2. 5.2 Pin Functions (HFQ/HKP Package)
    3. 5.3 Pin Functions (PGE Package)
  6. 6  Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Electrical Characteristics
    5. 6.5  Thermal Characteristics
    6. 6.6  ZPLL and Clock Specifications
    7. 6.7  RST and PORRST Timings
    8. 6.8  JTAG Scan Interface Timing
    9. 6.9  Output Timings
    10. 6.10 Input Timings
    11. 6.11 Flash Timings
    12. 6.12 SPIn Master Mode Timing Parameters
    13. 6.13 SPIn Slave Mode Timing Parameters
    14. 6.14 SCIN Isosynchronous Mode Timings - Internal Clock
    15. 6.15 SCIN Isosynchronous Mode Timings - External Clock
    16. 6.16 I2C Timing
    17. 6.17 Standard Can Controller (SCC) Mode Timings
    18. 6.18 Expansion Bus Module Timing
    19. 6.19 Multi-Buffered A-to-D Converter (MibADC)
  7. 7 Parameter Measurement Information
    1. 7.1 External Reference Resonator/Crystal Oscillator Clock Option
  8. 8 Detailed Description
    1. 8.1 Overview
      1. 8.1.1 MibADC
        1. 8.1.1.1 MibADC Event Trigger Enhancements
      2. 8.1.2 JTAG Interface
      3. 8.1.3 High-End Timer (HET) Timings
        1. 8.1.3.1 Minimum PWM Output Pulse Width
        2. 8.1.3.2 Minimum Input Pulses that can be Captured
      4. 8.1.4 Interrupt Priority (IEM to CIM)
      5. 8.1.5 Expansion Bus Module (EBM)
    2. 8.2 Memory
      1. 8.2.1 Memory Selects
        1. 8.2.1.1 JTAG Security Module
        2. 8.2.1.2 Memory Security Module
        3. 8.2.1.3 RAM
        4. 8.2.1.4 F05 Flash
          1. 8.2.1.4.1 Flash Protection Keys
          2. 8.2.1.4.2 Flash Read
          3. 8.2.1.4.3 Flash Pipeline Mode
          4. 8.2.1.4.4 Flash Program and Erase
          5. 8.2.1.4.5 HET RAM
          6. 8.2.1.4.6 Peripheral Selects and Base Addresses
          7. 8.2.1.4.7 Direct-Memory Access (DMA)
  9. 9 Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Device Identification Code Register
      2. 9.1.2 Timing Parameter Symbology
    2. 9.2 Development Support
    3. 9.3 Device Nomenclature
    4. 9.4 Documentation Support
    5. 9.5 Community Resources
    6. 9.6 Trademarks
    7. 9.7 Electrostatic Discharge Caution
    8. 9.8 Glossary
  10. 10Mechanical Packaging and Orderable Information
    1. 10.1 Packaging Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

2 Revision History

Changes from H Revision (September 2013) to I Revision

  • Added ESD Ratings table, Detailed Description section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section Go
  • Updated ICC standby mode maximum from 1.3 mA to to 28 mA Go

Changes from G Revision (July 2013) to H Revision

  • Changed temperature range condition on Electrical Characteristics tableGo
  • Added Thermal Information tableGo