JAJSQO9P October   1995  – February 2024 SN54AHC14 , SN74AHC14

PRODUCTION DATA  

  1.   1
  2. 1 特長
  3. 2 アプリケーション
  4. 3 概要
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Switching Characteristics, VCC = 3.3 V ± 0.3 V
    7. 5.7 Switching Characteristics, VCC = 5 V ± 0.5 V
    8. 5.8 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 ドキュメントの更新通知を受け取る方法
    3. 9.3 サポート・リソース
    4. 9.4 Trademarks
    5. 9.5 静電気放電に関する注意事項
    6. 9.6 用語集
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

パッケージ・オプション

デバイスごとのパッケージ図は、PDF版データシートをご参照ください。

メカニカル・データ（パッケージ｜ピン）
  • J|14
  • FK|20
  • W|14
サーマルパッド・メカニカル・データ
発注情報

5.4 Thermal Information

THERMAL METRIC(1) SN74AHC14 UNIT
D (SOIC) DB (SSOP) DGV (TVSOP) N (PDIP) NS (SO) PW (TSSOP) RGY (VQFN) BQA (WQFN)
14 PINS 14 PINS 14 PINS 14 PINS 14 PINS 14 PINS 14 PINS 14 PINS
RθJA Junction-to-ambient
thermal resistance		 124.5 137.8 141.9 61.9 94.7 147.7 87.1

88.3

 °C/W
RθJC(top) Junction-to-case (top)
thermal resistance		 78.8 90 61.1 49.5 52.5 77.4 92.6

90.9

 °C/W
RθJB Junction-to-board
thermal resistance		 81 98.3 71.3 41.7 53.4 90.9 62.5

56.8

 °C/W
ψJT Junction-to-top
characterization parameter		 37 42.7 9.7 34.7 21.3 27.2 22.8

9.9

 °C/W
ψJB Junction-to-board
characterization parameter		 80.6 97 70.6 41.7 53.1 90.2 61.7

56.7

 °C/W
RθJC(bot) Junction-to-case (bottom) thermal
resistance		 N/A N/A N/A N/A N/A N/A 45.1

33.4

 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.