JAJSV23K October   1995  – July 2024 SN54AHC374 , SN74AHC374

PRODUCTION DATA  

  1.   1
  2. 1 特長
  3. 2 アプリケーション
  4. 3 概要
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Electrical Characteristics
    6. 5.6  Timing Requirements, VCC = 3.3 V ± 0.3 V
    7. 5.7  Timing Requirements, VCC = 5 V ± 0.5 V
    8. 5.8  Switching Characteristics, VCC = 3.3 V ± 0.3 V
    9. 5.9  Switching Characteristics, VCC = 5 V ± 0.5 V
    10. 5.10 Noise Characteristics
    11. 5.11 Operating Characteristics
    12. 5.12 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Links
    2. 9.2 ドキュメントの更新通知を受け取る方法
    3. 9.3 サポート・リソース
    4. 9.4 Trademarks
    5. 9.5 静電気放電に関する注意事項
    6. 9.6 用語集
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

デバイスごとのパッケージ図は、PDF版データシートをご参照ください。

メカニカル・データ（パッケージ｜ピン）
  • W|20
  • J|20
  • FK|20
サーマルパッド・メカニカル・データ

5.4 Thermal Information

THERMAL METRIC(1) SN74AHC374 UNIT
DB DGV DW N NS PW
20 PINS
RθJA Junction-to-ambient thermal resistance 97.9 117.2 79.4 53.3 79.2 116.8 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 59.6 32.7 45.7 40.0 45.7 58.5
RθJB Junction-to-board thermal resistance 53.1 58.7 46.9 34.2 46.8 78.7
ψJT Junction-to-top characterization parameter 21.3 1.15 18.7 26.4 19.3 12.6
ψJB Junction-to-board characterization parameter 52.7 58.0 46.5 34.1 46.4 77.9
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A N/A N/A N/A N/A N/A
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report (SPRA953).