JAJSNY1F January   1996  – June 2022 SN54HC175 , SN74HC175

PRODUCTION DATA  

  1. 1 特長
  2. 2 アプリケーション
  3. 3 概要
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 Recommended Operating Conditions (1)
    3. 6.3 Thermal Information
    4. 6.4 Electrical Characteristics
    5. 6.5 Timing Requirements
    6. 6.6 Switching Characteristics
    7. 6.7 Operating Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Device Functional Modes
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
  11. 11Device and Documentation Support
    1. 11.1 Receiving Notification of Documentation Updates
    2. 11.2 サポート・リソース
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

パッケージ・オプション

デバイスごとのパッケージ図は、PDF版データシートをご参照ください。

メカニカル・データ（パッケージ｜ピン）
  • W|16
  • J|16
  • FK|20
サーマルパッド・メカニカル・データ
発注情報

6.3 Thermal Information

THERMAL METRIC D (SOIC) DB (SSOP) N (PDIP) NS (SO) PW (TSSOP) UNIT
16 PINS 16 PINS 16 PINS 16 PINS 16 PINS
RθJA Junction-to-ambient thermal resistance(1) 117.2 102.7 60.5 88.6 137.5 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 77.2 48.6 48 46.2 75.3 °C/W
RθJB Junction-to-board thermal resistance 75.6 54.4 40.5 50.8 82.2 °C/W
ψJT Junction-to-top characterization parameter 38.1 11.6 27.4 13.4 25.1 °C/W
ψJB Junction-to-board characterization parameter 75.3 53.6 40.3 50.4 81.8 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A N/A N/A N/A N/A °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC package thermal metrics application report.