JAJSNW9G December   1982  – October 2022 SN54HCT74 , SN74HCT74

PRODUCTION DATA  

  1. 1 特長
  2. 2 概要
  3. 3 Revision History
  4. 4 Pin Configuration and Functions
  5. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 Recommended Operating Conditions (1)
    3. 5.3 Thermal Information
    4. 5.4 Electrical Characteristics
    5. 5.5 Timing Requirements
    6. 5.6 Switching Characteristics
    7. 5.7 Operating Characteristics
  6. 6 Parameter Measurement Information
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Device Functional Modes
  8. 8 Power Supply Recommendations
  9. 9 Layout
    1. 9.1 Layout Guidelines
  10. 10Device and Documentation Support
    1. 10.1 Receiving Notification of Documentation Updates
    2. 10.2 サポート・リソース
    3. 10.3 Trademarks
    4. 10.4 Electrostatic Discharge Caution
    5. 10.5 Glossary
  11. 11Mechanical, Packaging, and Orderable Information

パッケージ・オプション

デバイスごとのパッケージ図は、PDF版データシートをご参照ください。

メカニカル・データ（パッケージ｜ピン）
  • J|14
  • FK|20
  • W|14
サーマルパッド・メカニカル・データ
発注情報

5.3 Thermal Information

THERMAL METRIC D (SOIC) DB (SSOP) N (PDIP) NS (SO) PW (TSSOP) UNIT
14 PINS 14 PINS 14 PINS 14 PINS 14 PINS
RθJA Junction-to-ambient thermal resistance(1) 138.7 109.8 61.1 88.4 114.7 °C/W
RθJC (top) Junction-to-case (top) thermal resistance 93.8 54.7 48.9 46 44.3 °C/W
RθJB Junction-to-board thermal resistance 94.7 58.6 40.9 48.9 57.6 °C/W
ΨJT Junction-to-top characterization parameter 49.1 15.5 28.5 13.8 4.8 °C/W
ΨJB Junction-to-board characterization parameter 94.3 58 40.6 48.4 57 °C/W
RθJC (bot) Junction-to-case (bottom) thermal resistance N/A N/A N/A N/A N/A °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC package thermal metrics application report.