JAJSEA4A September   2017  – December 2017 SN55HVD233-SP

PRODUCTION DATA.  

  1. 1 特長
  2. 2 アプリケーション
  3. 3 概要
    1.     Device Images
      1.      概略回路図
  4. 4 改訂履歴
  5. 5 概要（続き）
  6. 6 Pin Configuration and Functions
    1.     Pin Functions
  7. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Driver Electrical Characteristics
    6. 7.6  Receiver Electrical Characteristics
    7. 7.7  Driver Switching Characteristics
    8. 7.8  Receiver Switching Characteristics
    9. 7.9  Device Switching Characteristics
    10. 7.10 Typical Characteristics
  8. 8 Parameter Measurement Information
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Modes
      2. 9.3.2 Loopback
      3. 9.3.3 CAN Bus States
      4. 9.3.4 ISO 11898 Compliance of SN55HVD233-SP
        1. 9.3.4.1 Introduction
        2. 9.3.4.2 Differential Signal
          1. 9.3.4.2.1 Common-Mode Signal
        3. 9.3.4.3 Interoperability of 3.3-V CAN in 5-V CAN Systems
      5. 9.3.5 Thermal Shutdown
    4. 9.4 Device Functional Modes
  10. 10Application and Implementation
    1. 10.1 Application Information
      1. 10.1.1 Diagnostic Loopback
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
        1. 10.2.2.1 Slope Control
        2. 10.2.2.2 Standby
      3. 10.2.3 Application Curves
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
      1. 12.1.1 Bus Loading, Length, and Number of Nodes
      2. 12.1.2 CAN Termination
    2. 12.2 Layout Example
  13. 13デバイスおよびドキュメントのサポート
    1. 13.1 ドキュメントの更新通知を受け取る方法
    2. 13.2 コミュニティ・リソース
    3. 13.3 商標
    4. 13.4 静電気放電に関する注意事項
    5. 13.5 Glossary
  14. 14メカニカル、パッケージ、および注文情報

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

7.4 Thermal Information

THERMAL METRIC(2)(1)SN55HVD233-SPUNIT
HKX (CFP)
8 PINS
RθJA Junction-to-ambient thermal resistance 97.1 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 21.5 °C/W
RθJB Junction-to-board thermal resistance 79.1 °C/W
ψJT Junction-to-top characterization parameter 13.7 °C/W
ψJB Junction-to-board characterization parameter 73.6 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 7.0 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.
(2) All values except RθJC were taken on a JEDEC-51 standard High-K PCB using a nominal lead form. Differences in lead form, component density, or PCB design can affect these values.