JAJSFO2I september   2012  – october 2020 SN65DSI83

PRODUCTION DATA  

  1.   1
  2. 1 特長
  3. 2 アプリケーション
  4. 3 概要
  5. 4 Revision History
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings #GUID-BDB96F65-5C5F-4805-AA4B-B71B15ADA38F/SLLSEB91839
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Switching Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Clock Configurations and Multipliers
      2. 7.3.2 ULPS
      3. 7.3.3 LVDS Pattern Generation
    4. 7.4 Device Functional Modes
      1. 7.4.1 Reset Implementation
      2. 7.4.2 Initialization Sequence
      3. 7.4.3 LVDS Output Formats
      4. 7.4.4 DSI Lane Merging
      5. 7.4.5 DSI Pixel Stream Packets
      6. 7.4.6 DSI Video Transmission Specifications
    5. 7.5 Programming
      1. 7.5.1 Local I2C Interface Overview
    6. 7.6 Register Maps
      1. 7.6.1 Control and Status Registers Overview
  9. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Video STOP and Restart Sequence
      2. 8.1.2 Reverse LVDS Pin Order Option
      3. 8.1.3 IRQ Usage
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Example Script
      3. 8.2.3 Application Curve
  10. 9 Power Supply Recommendations
    1. 9.1 VCC Power Supply
    2. 9.2 VCORE Power Supply
  11. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Package Specific
      2. 10.1.2 Differential Pairs
      3. 10.1.3 Ground
    2. 10.2 Layout Example
  12. 11Device and Documentation Support
    1. 11.1 Receiving Notification of Documentation Updates
    2. 11.2 Community Resources
    3. 11.3 Trademarks
  13.   Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

10.1.1 Package Specific

For the ZXH package, to minimize the power supply noise floor, provide good decoupling near the SN65DSI83 device power pins. The use of four ceramic capacitors (2 × 0.1 μF and 2 × 0.01 μF) provides good performance. At the least, TI recommends to install one 0.1-μF and one 0.01-μF capacitor near the SN65DSI83 device. To avoid large current loops and trace inductance, the trace length between decoupling capacitor and device power inputs pins must be minimized. Placing the capacitor underneath the SN65DSI83 device on the bottom of the PCB is often a good choice.