JAJSFO0G september   2012  – october 2020 SN65DSI85

PRODUCTION DATA  

  1.   1
  2. 1 特長
  3. 2 アプリケーション
  4. 3 概要
  5. 4 Revision History
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings #GUID-24B27461-2407-4A70-B6CA-5D1E4961612D/SLLSEB91839
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
  8.   Parameter Measurement Information
  9. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Clock Configurations and Multipliers
      2. 7.3.2 ULPS
      3. 7.3.3 LVDS Pattern Generation
    4. 7.4 Device Functional Modes
      1. 7.4.1 Operating Modes
      2. 7.4.2 24
      3. 7.4.3 Reset Implementation
      4. 7.4.4 Initialization Sequence
      5. 7.4.5 LVDS Output Formats
      6. 7.4.6 DSI Lane Merging
      7. 7.4.7 DSI Pixel Stream Packets
      8. 7.4.8 DSI Video Transmission Specifications
    5. 7.5 Programming
      1. 7.5.1 Local I2C Interface Overview
    6. 7.6 Register Maps
      1. 7.6.1 Control and Status Registers Overview
  10. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Video STOP and Restart Sequence
      2. 8.1.2 Reverse LVDS Pin Order Option
      3. 8.1.3 IRQ Usage
    2. 8.2 Typical Applications
      1. 8.2.1 Typical WUXGA 18-bpp Application
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Example Script
        3. 8.2.1.3 Application Curve
      2. 8.2.2 Typical WQXGA 24-bpp Application
        1. 8.2.2.1 Design Requirements
  11. 9 Power Supply Recommendations
    1. 9.1 VCC Power Supply
    2. 9.2 VCORE Power Supply
  12. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Package Specific
      2. 10.1.2 Differential pairs
      3. 10.1.3 Ground
    2. 10.2 Layout Example
  13. 11Device and Documentation Support
    1. 11.1 Receiving Notification of Documentation Updates
    2. 11.2 Community Resources
    3. 11.3 Trademarks
  14. 12Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

8 Application and Implementation

Note:

Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes. Customers should validate and test their design implementation to confirm system functionality.