JAJSV27E September   2010  – October 2024 SN65HVD1780-Q1 , SN65HVD1781-Q1 , SN65HVD1782-Q1

PRODUCTION DATA  

  1.   1
  2. 1 特長
  3. 2 アプリケーション
  4. 3 概要
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings—AEC
    3. 5.3  ESD Ratings—IEC
    4. 5.4  Recommended Operating Conditions
    5. 5.5  Thermal Information
    6. 5.6  Electrical Characteristics
    7. 5.7  Power Dissipation Ratings
    8. 5.8  Switching Characteristics
    9. 5.9  Package Dissipation Ratings
    10. 5.10 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Bus Fault Conditions
      2. 7.3.2 Receiver Failsafe
      3. 7.3.3 Hot-Plugging
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
        1. 8.2.1.1 Data Rate and Bus Length
        2. 8.2.1.2 Bus Loading
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Stub Length
        2. 8.2.2.2 Receiver Failsafe
      3. 8.2.3 Application Curve
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 サード・パーティ製品に関する免責事項
    2. 9.2 Documentation Support
      1. 9.2.1 Related Documentation
    3. 9.3 ドキュメントの更新通知を受け取る方法
    4. 9.4 サポート・リソース
    5. 9.5 Trademarks
    6. 9.6 静電気放電に関する注意事項
    7. 9.7 用語集
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

5.5 Thermal Information

THERMAL METRIC(1)SN65HVD1780-Q1
SN65HVD1781-Q1
SN65HVD1782-Q1		UNIT
D (SOIC)
8 PINS
RθJAJunction-to-ambient thermal resistanceJEDEC high-K model138°C/W
JEDIC low-K model242°C/W
RθJC(top)Junction-to-case (top) thermal resistance61°C/W
RθJBJunction-to-board thermal resistance62°C/W
ψJTJunction-to-top characterization parameter3.8°C/W
ψJBJunction-to-board characterization parameter38.6°C/W
RθJC(bot)Junction-to-case (bottom) thermal resistanceN/A°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.